QUALIFICATION REPORT
EPC Reliability & Quality
EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2020 | | 1
EPC eGaN® FET
Qualication Report
EPC2059
EFFICIENT POWER CONVERSION
Dr. Robert Strittmatter, Vice President of Reliability, Efficient Power Conversion Corporation
This report summarizes the Product Qualication results for EPC
part number EPC2059 which meets all required qualication
requirements and is released for production.
Qualication Test Overview
EPC’s eGaN FETs were subjected to a wide variety of stress tests
under conditions that are typical for silicon-based power MOSFETs.
These tests included:
– High temperature reverse bias (HTRB): Parts are subjected to a drain-
source voltage at the maximum rated temperature
– High temperature gate bias (HTGB): Parts are subjected to a gate-
source voltage at the maximum rated temperature
– High temperature storage (HTS): Parts are subjected to heat at the
maximum rated temperature
– Temperature cycling (TC): Parts are subjected to alternating high-
and low temperature extremes
– High temperature high humidity reverse bias (H3TRB): Parts are
subjected to humidity under high temperature with a drain-source
voltage applied
The stability of the devices is veried with DC electrical tests after stress
biasing. The electrical parameters are measured at time-zero and at
interim readout points at room temperature. Electrical parameters
such as the gate-source leakage, drain-source leakage, gate-source
threshold voltage, and on-state resistance are compared against the
data sheet specications. A failure is recorded when a part exceeds the
datasheet specications. eGaN FETs are stressed to meet the latest Joint
Electron Device Engineering Council (JEDEC) standards when possible..
Parts for all tests except for TC were mounted onto FR5 (high Tg FR4) or
polyimide adaptor cards. Adaptor cards of 1.6 mm in thickness with two
copper layers were used. The top copper layer was 1 oz. or 2 oz., and
the bottom copper layer was 1 oz. Kester NXG1 type 3 SAC305 solder no
clean ux was used in mounting the part onto an adaptor card.
Scope
The testing matrix in this qualication report covers the qualication
of EPC2059 listed in the table below. EPC2059, EPC2215, and EPC2218
have the same device processing, packaging process and similar bump
design.
Part Number
Voltage
(V)
R
DS(on)
(mΩ)
Die Size
(mm x mm)
EPC2215 200 8 L (4.6 x 1.6)
EPC2218 100 3.2 L (3.5 x 1.95)
EPC2059 170 9 S (2.8 x 1.4)