REF :20080804-A PAGE: 1
SPECIFICATION FOR APPROVAL
PROD.
NAME
ABC'S DWG NO.
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS:
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒MATERIALS:
Ⅳ﹒GENERAL SPECIFICATION:
m/mA : 5.20 ±0.20
m/m
m/m
m/m
m/m
G : 2.00 ref.
E : 1.80 typ.
D : 1.70 typ.
C : 1.60 ±0.20
d
b
a
c
H : 3.70 ref.
I : 1.10 ref.m/m
m/m
B : 5.20 ±0.20
( PCB Pattern Suggestion )
LCR Meter
AR-001A
BDD
F
E C
F : 3.90 typ.m/m
A
G
I
I
G
I
IH
H
100
e﹒Terminal:Ag/Ni/Sn
d﹒Adhesive :Epoxy resin
b﹒Core:Ferrite RI core
c﹒Wire :Enamelled copper wire (class F & H)
a﹒Core:Ferrite DR core
SU5016□□□□L□-□□□
SHIELDED SMD
POWER INDUCTOR
e
b﹒Rated current:
d﹒Operating temp.:-40℃----+105℃
c﹒Storage temp.:-40℃ ----+125℃
a﹒Temp. rise :40℃ max.
e﹒Resistance to solder heat:260℃.10 secs.
Base on temp. rise & L / L0A=35% typ.△
Temperature ( )℃
50sec max.
200
100
0
50
50
150
200
250
Time ( seconds )
100150
70sec max.
150 ~ 200 / 60 ~ 120sec ℃
Preheat Area
Max time above 200℃ :70sec max.
Max time above 230℃ :50sec max.
Peak Temp: 260℃ max.
Rising Area
Temperature
+4.0 / sec max.℃
/ sec max.
+2.0 ~ 4.0 ℃
Reflow Area
260℃
250
230℃
Forced Cooling Area
-(1.0 ~ 5.0) / sec max.℃
Peak Temperature:
m/m
requirements
f﹒Remark:Products comply with RoHS'