Micron Parallel NOR Flash Embedded
Memory (P30-65nm)
JS28F512P30BFx, JS28F512P30EFx, JS28F512P30TFx,
PC28F512P30BFx, PC28F512P30EFx, PC28F512P30TFx,
JS28F00AP30BFx, JS28F00AP30TFx, JS28F00AP30EFx,
PC28F00AP30BFx, PC28F00AP30TFx, PC28F00AP30EFx,
RC28F00AP30BFx, RC28F00AP30TFx, PC28F00BP30EFx
Features
High performance
Easy BGA package features
100ns initial access for 512Mb, 1Gb Easy BGA
105ns initial access for 2Gb Easy BGA
25ns 16-word asynchronous page read mode
52 MHz (Easy BGA) with zero WAIT states and
17ns clock-to-data output synchronous burst
read mode
4-, 8-, 16-, and continuous word options for burst
mode
TSOP package features
110ns initial access for 512Mb, 1Gb TSOP
Both Easy BGA and TSOP package features
Buffered enhanced factory programming (BEFP)
at 2 MB/s (TYP) using a 512-word buffer
1.8V buffered programming at 1.46 MB/s (TYP)
using a 512-word buffer
Architecture
MLC: highest density at lowest cost
Symmetrically blocked architecture (512Mb, 1Gb,
2Gb)
Asymmetrically blocked architecture (512Mb,
1Gb); four 32KB parameter blocks: top or bottom
configuration
128KB main blocks
Blank check to verify an erased block
Voltage and power
V
CC
(core) voltage: 1.7–2.0V
V
CCQ
(I/O) voltage: 1.7–3.6V
Standby current: 70µA (TYP) for 512Mb; 75µA
(TYP) for 1Gb
52 MHz continuous synchronous read current:
21mA (TYP), 24mA (MAX)
16-bit wide data bus
Security
One-time programmable register: 64 OTP bits,
programmed with unique information from Mi-
cron; 2112 OTP bits available for customer pro-
gramming
Absolute write protection: V
PP
= V
SS
Power-transition erase/program lockout
Individual zero-latency block locking
Individual block lock-down
Password access
Software
25μs (TYP) program suspend
25μs (TYP) erase suspend
Flash Data Integrator optimized
Basic command set and extended function inter-
face (EFI) command set compatible
Common flash interface
Density and packaging
56-lead TSOP package (512Mb, 1Gb)
64-ball Easy BGA package (512Mb, 1Gb, 2Gb)
Quality and reliability
JESD47 compliant
Operating temperature: –40°C to +85°C
Minimum 100,000 ERASE cycles per block
65nm process technology
512Mb, 1Gb, 2Gb:
P30-65nm
Features
09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. D 5/17 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Discrete and MCP Part Numbering Information
Devices are shipped from the factory with memory content bits erased to 1. For available options, such as pack-
ages or for further information, contact your Micron sales representative. Part numbers can be verified at www.mi-
cron.com. Feature and specification comparison by device type is available at www.micron.com/products. Con-
tact the factory for devices not found.
Note: Not all part numbers listed here are available for ordering.
Table 1: Discrete Part Number Information
Part Number Category Category Details
Package JS = 56-lead TSOP, lead free
PC = 64-ball Easy BGA, lead-free
RC = 64-ball Easy BGA, leaded
Product Line 28F = Micron Flash memory
Density 512 = 512Mb
00A = 1Gb
00B = 2Gb
Product Family P30 (V
CC
= 1.7–2.0V; V
CCQ
= 1.7–3.6V)
Parameter Location B/T = Bottom/Top parameter
E = Symmetrical Blocks
Lithography F = 65nm
Features *
Note:
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: JS28F512P30EF*
Table 2: Standard Part Numbers
Density Configuration Medium JS PC RC
512Mb Bottom boot Tray JS28F512P30BFA PC28F512P30BFA
Tape and Reel PC28F512P30BFB
Top boot Tray JS28F512P30TFA PC28F512P30TFA
Tape and Reel PC28F512P30TFB
Uniform Tray JS28F512P30EFA PC28F512P30EFA
Tape and Reel
1Gb Bottom boot Tray JS28F00AP30BFA PC28F00AP30BFA RC28F00AP30BFA
Tape and Reel PC28F00AP30BFB
Top boot Tray JS28F00AP30BTFA PC28F00AP30TFA RC28F00AP30TFA
Tape and Reel
Uniform Tray JS28F00AP30EFA PC28F00AP30EFA
Tape and Reel
2Gb Uniform Tray PC28F00BP30EFA
Tape and Reel
512Mb, 1Gb, 2Gb:
P30-65nm
Features
09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. D 5/17 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.