QUALIFICATION REPORT
EPC Reliability & Quality
EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2020 | | 1
EPC eGaN® FET
Qualication Report
EPC2218
EFFICIENT POWER CONVERSION
Dr. Robert Strittmatter, Vice President of Reliability, Efficient Power Conversion Corporation
This report summarizes the Product Qualication results for EPC
part number EPC2218. The EPC2218 meets all required qualication
requirements and is released for production.
Qualication Test Overview
EPC’s eGaN FETs were subjected to a wide variety of stress tests
under conditions that are typical for silicon-based power MOSFETs.
These tests included:
– High temperature reverse bias (HTRB): Parts are subjected to a drain-
source voltage at the maximum rated temperature
– High temperature gate bias (HTGB): Parts are subjected to a gate-
source voltage at the maximum rated temperature
– High temperature storage (HTS): Parts are subjected to heat at the
maximum rated temperature
– Temperature cycling (TC): Parts are subjected to alternating high-
and low temperature extremes
– High temperature high humidity reverse bias (H3TRB): Parts are
subjected to humidity under high temperature with a drain-source
voltage applied
All The stability of the devices is veried with DC electrical tests after
stress biasing. The electrical parameters are measured at time-zero and
at interim readout points at room temperature. Electrical parameters
such as the gate-source leakage, drain-source leakage, gate-source
threshold voltage, and on-state resistance are compared against the
data sheet specications. A failure is recorded when a part exceeds the
datasheet specications. eGaN FETs are stressed to meet the latest Joint
Electron Device Engineering Council (JEDEC) standards when possible.
Parts for all tests except for TC were mounted onto FR5 (high Tg FR4) or
polyimide adaptor cards. Adaptor cards of 1.6 mm in thickness with two
copper layers were used. The top copper layer was 1 oz. or 2 oz., and
the bottom copper layer was 1 oz. Kester NXG1 type 3 SAC305 solder no
clean ux was used in mounting the part onto an adaptor card.
Scope
The testing matrix in this qualication report covers the qualication of
EPC2218 listed in the table below.
Part Number
Voltage
(V)
R
DS(on)
(mΩ)
Die Size
(mm x mm)
EPC2218 100 3.2 L (3.5 x 1.95)
EPC2204 100 6 S (2.5 x 1.5)
QUALIFICATION REPORT
EPC Reliability & Quality
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High Temperature Gate Bias
Parts were subjected to 6 V gate-source bias at the maximum rated temperature for a stress period of 1000 hours.
High Temperature Storage
Parts were subjected to heat at the maximum rated temperature.
Temperature Cycling
Parts loaded into trays were subjected to temperature cycling between -40°C and +125°C, with dwell time of 10 minutes and 2 cycles/hour in
accordance with the JEDEC Standard JESD22A104.
Table 2. High Temperature Gate Bias Test
Table 3. High Temperature Storage Test
Table 4. Temperature Cycling Test
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(unit x lot)
Duration
(Hrs)
HTGB
EPC2218
100 L (3.5 x 1.95) T = 150°C, V
GS
= 6 V 0 77 x 1 1000
HTGB
EPC2218
100 L (3.5 x 1.95) T = 150°C, V
GS
= 6 V 0 77 x 1 1000
HTGB
EPC2204
100 S (2.5 x 1.5) T = 150°C, V
GS
= 6 V 0 77 x 1 1000
HTGB
EPC2204
100 S (2.5 x 1.5) T = 150°C, V
GS
= 6 V 0 77 x 1 1000
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(unit x lot)
Duration
(Hrs)
HTS
EPC2218
100 L (3.5 x 1.95) T = 150°C, Air 0 77 x 1 1000
HTS
EPC2218
100 L (3.5 x 1.95) T = 150°C, Air 0 77 x 1 1000
HTS
EPC2204
100 S (2.5 x 1.5) T = 150°C, Air 0 77 x 1 1000
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(unit x lot)
Duration
(Cys)
TC
EPC2218
100 L (3.5 x 1.95) -40 to +125°C, Air 0 77 x 1 850
TC
EPC2218
100 L (3.5 x 1.95) -40 to +125°C, Air 0 77 x 1 850
TC
EPC2218
100 L (3.5 x 1.95) -40 to +125°C, Air 0 77 x 1 850
High Temperature Reverse Bias
Parts were subjected to 80% of the rated drain-source voltage at the maximum rated temperature for a stress period of 1000 hours.
Table 1. High Temperature Reverse Bias Test
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(unit x lot)
Duration
(Hrs)
HTRB
EPC2218
100 L (3.5 x 1.95) T = 150°C, V
DS
= 80 V 1 160 x1 1000
HTRB
EPC2204
100 S (2.5 x 1.5) T = 150°C, V
DS
= 80 V 0 160 x1 1000
HTRB
EPC2204
100 S (2.5 x 1.5) T = 150°C, V
DS
= 80 V 0 160 x1 1000