Application Note
R20AN0585EU0100 Rev.1.00 Page 1 of 5
Oct.02.20
Renesas RA Family
EK-RA6M4 Exampl e Project Bundle
Introduction
This document describes the contents of the Example Proj ec t Bundle for the EK-RA6M4 kit. The Exam pl e
Projects contained within the bundle provide example code for creating various Renesas Flexible Software
Package (FSP) modules supported by the EK-RA6M4 kit.
Flexible Software Package is an optimized software package designed to provide easy to use, scalable, high
quality software for embedded system design. The primary goal is to provide lightweight, efficient drivers that
meet common use cases in embedded systems. FSP code quality is enforced by peer reviews, automated
requirements-based testing, and automa ted st atic ana l ys is. FSP provides uni for m and int uit ive APIs t hat are
well documented. Each module is supported with detailed user documentation including example code. FSP
modules can be used on any MCU in the RA family, provided the MCU has peripherals required by the
module. FSP modules also have build-time configurations that can be used to optimize the size of the
module for the feature set required by the application.
Supported Kit
EK-RA6M4
Supported FSP Version
FSP v 2.0.0 or later
Supported Toolcha ins
• e² studio Integrated Development Environment (IDE), default toolchain is GCC Arm Embedded
• Arm Keil MDK with Arm compiler toolchain
• IAR EWARM with IAR toolchain for Arm
1. Using the Example Projects
To use EK-RA6M4 Example Projects follow the steps mentioned in the fol low in g documents:
• Example Project Usage Guide
https://github.com/renesas/ra-fsp-
examples/blob/master/example_projects/Example%20Project%20Usage%20Guide.pdf
• e² studio AC6 porting Guide
https://en-support.renesas.com/knowledgeBase/19375553