ATP e.MMC v5.1
Embedded Flash Storage Solution
• AEC-Q100 Grade 2
(-40°C~105°C) Compliant
• AEC-Q100 Grade 3
(-40°C~85°C) Compliant
• Extra-high endurance: 2-3X higher
than standard e.MMC
• Native SLC NAND with 60K P/E cycle
• Complies with JEDEC e.MMC v5.1
Standard (JESD84-B51)
• 153-ball FBGA (RoHS compliant,
"green package")
• LDPC ECC engine*
• Designed with 3D NAND
• Surveillance
• IoT Gateways / 5G Small Cell
• Automation
• Test and Measurement
• Embedded PCs
• Medical
• Drones
• Transportation
• Networking
• Mobile/Handheld Computers
Key Features
Applications
The ATP industrial e.MMC is an advanced storage solution that integrates
NAND flash memory, a sophisticated flash controller, and a fast MultiMedia
Card (MMC) interface in the same package. By incorporating these
components in an integrated package, ATP e.MMC manages all background
operations internally, freeing the host from handling low-level flash
operations for faster and more efficient processing.
Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine
pitch ball grid array (FBGA package). The tiny footprint makes it perfectly
suitable for embedded systems with space constraints but require rugged
endurance, reliability and durability in harsh environments.
ATP e.MMC is built to meet the tough demands of industrial applications.
As a soldered-down solution, it is secure against constant vibrations. Its
industrial temperature rating means that severe scenarios from freezing
cold -40°C to blistering hot 105°C will not cause adverse impact on the
device or the data in it.
Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP
e.MMC features Command Queuing and Cache Barrier to enhance random
read/write performance; High Speed 400 (HS400) DDR Mode for a
bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache
Flushing Report ensures the data integrity on cache blocks; Enhanced
Strobe in HS400 Mode facilitates faster synchronization between the host
and the e.MMC device; and, Secure Write Protection ensures that only
trusted entities can protect or unprotect the e.MMC device.
It is backward compatible with previous versions (v4.41/v4.5/v5.0),
supporting features such as power-off notifications, packed commands,
cache, boot or replay protected memory block (RPMB) partitions, high
priority interrupt (HPI), and hardware (HW) reset.
Industrial-Grade Performance, Extreme Endurance & Reliability
www.atpinc.com
07072020
TEL: +886-2-2659-6368
FAX: +886-2-2659-4982
sales-apac@atpinc.com
TEL: +1-408-732-5000
FAX: +1-408-732-5055
sales@atpinc.com
ATP EUROPEATP USAATP TAIWAN(HQ)
TEL: +49-89-374-9999-0
FAX: +49-89-374-9999-29
sales-europe@atpinc.com
ATP JAPAN
TEL: +81-3-6260-0797
FAX: +81-3-6260-0798
sales-japan@atpinc.com
TEL: +86-21-5080-2220
FAX: +86-21-9687-0000-026
sales@cn.atpinc.com
ATP CHINA
Specifications
To learn more about this product, contact your ATP Representative.
ATP Global Footprint
www.atpinc.com
Technologies &
Add-On Services
Product Line
Premium
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Superior
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∆: Customization option available on a project basis.
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∆
∆
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Life Monitor Sudden Power-off
Recovery (SPOR)
Data Path
Protection
AutoRefresh Vibration-Proof
BGA Package
Dynamic Data
Refresh
Industrial
Temperature
SiP
(System in Package)
Complete Drive Test
∆
*Low-density parity-check error correcting code. By product support.
**All performance is collected or measured using ATP proprietary test environment, without file system overhead.
Product Name
e.MMC
Industrial GradeCommercial Grade Automotive Grade 3 Automotive Grade 2
Product Line Premium Superior Premium Superior Premium Superior
Naming E700Pi E600Si E700Pia E600Sia E700Paa E600Saa
IC Package 153-ball FBGA
JEDEC Specification v5.1, HS400
Flash Type 3D
pseudo SLC
3D NAND 3D
pseudo SLC
3D NAND 3D
pseudo SLC
3D NAND
Density 8 GB to 64 GB 16 GB to 128 GB 8 GB to 64 GB 16 GB to 128 GB 8 GB to 64 GB 16 GB to 128 GB
Bus Speed Modes x1 / x4 / x8
Performance**
Seq. Read/Write up
to (MB/s)
300 / 240 300 / 170 300 / 240 300 / 170 300 / 240 300 / 170
Random Read/Write
up to (IOPS)
15K / 30K
Operating Temperature -40°C to 85°C (Industrial)-25°C to 85°C -40°C to 85°C (AEC-Q100 Grade 3) -40°C to 105°C (AEC-Q100 Grade 2)
Reliability
Max. TBW** 1320 TB 824 TB 1320 TB 824 TB 1213 TB 309 TB
MTBF @ 25°C > 2,000,000 Device hours
ICC (Typical RMS in Read/Write) mA 135 / 155 135 / 180 135 / 155 135 / 180 135 / 155 135 / 180
ICCQ (Typical RMS in Read/Write) mA 110 / 95
Premium
E700Pc
3D
pseudo SLC
10 GB to 21 GB
290 / 220
296 TB
80 / 99
109 / 94
110 / 100 110 / 95 110 / 100 110 / 95 110 / 100
Dimensions: L x W x H (mm) 11.5 x 13.0 x 1.0