PACKAGE INFORMATION
PE-WLCSP-8-P1-190704
WLCSP-8-P1 Unit: mm
PACKAGE DIMENSIONS
TAPING SPECIFICATION
TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc)
1 reel = 5,000 pcs
0.20±0.05 1.5
+0.
1
0
4.0±0.1
2.0±0.05
3.5±0.05
1.75±0.1
8.0±0.3
0.5±0.05
4.0±0.1
2.0±0.05
1.60
1.63
0.48±0.05
Dummy Pocket
TR
User Direction of Feed
PACKAGE INFORMATION
PE-WLCSP-8-P1-190704
POWER DISSIPATION (WLCSP-8-P1)
The power diss
ipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 101.5 mm x 114.5 mm x 1.6 mm
Copper Ratio
Outer Layer (First Layer): 10% 50um
Inner Layers (Second and Third Layers): 99.5 x 99.5mm 100% 70um
Outer Layer (Fourth Layer): 10% 50um
Measure
ment Result
(Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 840 mW
Thermal Resistance (ja) ja = 119°C/W
ja: Junction-to-Ambient Thermal Resistance
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
0
100
200
300
400
500
600
700
800
900
1000
0 25 50 75 100 125
Power Dissipation (mW)
Ambient Temperature (°C)
85
840