Appendix

■HANDLING PRECAUTIONS

Please use the each product under the conditions provided in respective specifications and catalogues.

The crystal products are designed and manufactured to satisfy its specification, and quality and reliability of the products are ensured

through our stringent reliability tests before shipments. However, it is essential to store, mount, and use the products under proper

conditions in order to keep the quality and reliability. Please pay careful attention to following precautions and use the products under the

optimal conditions. We shall not be responsible for any deteriorated performance of the products caused by any application or usage of

the products adopted at customer's own discretion.

■Common points for all products

1. Shock resistance

Crystal products may be damaged under some conditions, such as dropping from desks or receiving shocks during mounting. Please

do not use the products if products have received any excessive shocks.

2. Radiation

Exposure to radiation can cause deterioration in performance, so avoid irradiation.

3. Chemicals / pH

Do not use or store the product in a pH range that may cause corrosion or dissolution of the materials or packaging.

4. Adhesive

Do not use an adhesive that may cause corrosion of the packing materials, terminals, components, glass materials, and vapor

deposited materials used in the products. (For example, a chlorine-based adhesive may corrode the metal parts “lid” of a crystal unit to

diminish the hermetic qualities, lowering the performance.)

5. Halogen Compound

Do not use products in halogen gas. Even a slight amount of halogen gas, such as that found in chlorine gas in the air or in metal parts

used in the package, may corrode. Also, do not use any resin that emits halogen gas.

6. Static electricity

Excessive levels of static electricity may damage the product, please treat it in anti-static condition. Choose conductive materials for

containers and packing materials. Use a soldering gun and a measurement circuit free from high-voltage leakage and provide

grounding conduction when working with them.

7. When designing

7.1 The affect of mechanical vibration

While there is any given shock or mechanical vibration periodically to crystal products, such as, a piezo sounder, a piezo buzzer, and

speaker, to crystal products, output frequency and amplitude can be changed. Especially the quality of telecommunication equipment

could be affected by this phenomenon. Although crystal products are designed to minimize the effect of mechanical vibration, we

recommend to check them in advance and to follow the PCB design guidelines as below.

7.2PCB design guidelines

(1) Ideally, the mechanical buzzer source should be mounted on a separate PCB from the crystal device. It is advisable to use cushion

or cutting PCB, if you mount on same PCB. Traveling mechanical vibration differs when applied to the PCB only vs. inside the body.

It is advisable to confirm characteristics in the body.

(2) Refer to the recommend footprint when designing.

(3) In case of using solder flux, please use it on the basis of the flux of the JIS standard (JIS C 60068-2-20/IEC 60,068-2-20).

(4) Please use the solder on the basis of the JIS standard (JIS Z 3282, Pb content 1000ppm, 0.1wt% or less) lead -free solder.

8. Notes on storage

(1) Storing the crystal products under higher or lower temperature or high humidity for a long period may affect frequency stability or

solderability. Please store the crystal products at the normal temperature and humidity, avoid storing them for a long period and

mount them as soon as possible after unpacking.

Normal temperature and humidity:

Temp,+15 °C to+35 °C, humidity 25 % RH to 85 % RH

(2) Please carefully handle the inner and outer boxes and reel. External pressure may cause deformation of reel and tape.

9. Mounting precautions

9.1 Soldering heat resistance

The crystal products except SMD products use solder having a +180°C to +200°C melting point. Heating up the package more than

+150°C may deteriorate the characteristics or damage the products. If the crystal products need to be soldered at temperature of more

than +150°C, SMD products are recommended. Using higher temperatures over the following reflow conditions to crystal products,

even SMD products, may cause the characteristics to deteriorate. The reflow conditions within following profile are recommended.

Always check the soldering temperature and time before mounting these products. Also, please check them again when the mounting

conditions are changed. Please contact us for inquiries about heat-resistance if crystal products need to be soldered over the following

profile.

(1) Cylinder products and DIP products

Model

Soldering conditions

[

Cylinder ] HTS-206

+280 °C or under @ Max. 5 s.

Do not heat the package at more than +150

[

DIP ] SG- 531P, SG-8002 DC,

+260 °C or under @ Max.10 s.

Do not heat the package at more than +150 °C.

Appendix

(2) SMD products Reflow profile (example)

The availability of the heat resistance for reflow conditions of JEDEC-STD-020D.01 is judged individually. Please inquire it.

Please make temperature rate as gentle a curve as possible.