The table below is the JEDEC MO-220 listing of the “Thermally Enhanced Thin and Very Thin” QFN devices
The Ironwood part number listed designates the socket we have designed for the various standard QFN devices by BODY
SIZE LEAD COUNT and PITCH.
The design has a press that will accommodate the device thickness in the range of the MIN and MAX listed. If you have a
device thickness outside the limits we can accommodate this easily with either a modified press or one from another
design
The contacts in the center for the ground pad lists the Minimum size the socket will accommodate. Other ground
configuration can be designed and Solid ground blocks also can be design for maximum thermal dissipation when
required.
Ironwood also has 100’s of additional designs for other variations of QFN, QFP and DFN and SO devices.
Always submit a package drawing so we can ensure the proper fit
CAD Footprint drawings are available for all the socket part numbers listed for your PCB layout.