SPECIFICATION SHEET
© Copyright 2019 Ironwood Electronics
/
All rights reserved
/
Data subject to change without notice
Ironwood Electronics
/
1335 Eagandale Ct., Eagan, MN 55121 USA
+1.952.229.8200
/
info@ironwoodelectronics.com
/
www.ironwoodelectronics.com
Grypper Y
9_18
700000-0015rG
Grypper Y
High Performance Near Zero Footprint Sockets
for 0.40 + pitch devices. New Y contact is less
aggressive to device solder ball allowing multiple
insertions of the same deviceLower insertion -
positive retention with spring bias Lid
Ironwood Electronics new Grypper Y contact is design to work with BGA devices with solder balls/bumps with no
equator or small exposure where the standard Grypper cannot reliable hold onto the solder ball. The Y shape,
working with the lid, allows reliable contact and ensures device retention in high vibration application. Lower forces,
< 25 grams, makes insertion easier too and the less aggressive contacting allows 20-40 insertions of the same device.
The Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.40 pitch and larger
and the short electrical length has superior electrical performance.
FEATURES AND BENEFITS
Near Zero PCB footprint The Grypper Y socket footprint is only 1 mm larger than
the DUT. Typically this footprint will fit into any end
application allowing the Grypper Y socket to be directly
reflowed into the same location as the device.
Soft contacting The Y shape results in a wiping action and less aggressive
contact to the solder ball which allows multiple insertions
of the same device. The removal force is extremely low at
~3 grams / contact.
Lid The Lid is used to insert the device and assures excellent
contact. The screw on the top releases the press onto the
device so the forces are controlled and balance to each
application. Different materials can be design in the lid to
act as a heat sink.
Excellent signal performance The Short signal path and two points of contact, achieves
low CRES and low insertion loss.
METHODOLOGY
Cross section view of test socket and BGA device
SPECIFICATION SHEET
© Copyright 2019 Ironwood Electronics
/
All rights reserved
/
Data subject to change without notice
Ironwood Electronics
/
1335 Eagandale Ct., Eagan, MN 55121 USA
+1.952.229.8200
/
info@ironwoodelectronics.com
/
www.ironwoodelectronics.com
Grypper Y
9_18
700000-0015rG
CONTACT
Y
Minimum Pitch (mm) Ball Diameter (mm) Contact Length (mm)
0.80 0.55 2.2
0.80 0.50 2.2
0.80 0.45 2.2
0.65 0.40 1.6
0.50 0.35 1.6
0.50 0.30 1.6
0.40 0.25 1.6
Bold listing above tooled / available with 3-4 weeks delivery- others under development -lead time 6-8 + weeks
ELECTRICAL SPECIFICATIONS
Measured result listed below for 0.8 pitch 0.55 solder ball contact configuration
Contact Ironwood for RF simulation and model reports, HFSS and S parameter files.
Field Edge Corner
Loop inductance 0.540 nH 0.630 nH 0.720 nH
Mutual inductance 0.139 nH 0.141 nH 0.161 nH
Capacitance 0.227 pF 0.218 pF 0.209 pF
Mutual Capacitance 0.046 pF 0.050 pF 0.640 pF
S21 Insertion loss (-1 dB) >40 GHz >40 GHz 16.1 GHz
S11 Return loss (-20 dB) >40 GHz 13.2 GHz 8.6 GHz
S41 Crosstalk (GSSG) N/A -20dB @>40 GHz N/A
Impedance 53.6 Ω 56.2 Ω 60.1 Ω
Time Delay 12.7 ps 12.9 ps 13.5ps
Current Carrying Capacity 6.4 Amps DC @ 20° C Rise
CRES <50 mΩ <50 mΩ <50 mΩ
= Signal
= Ground
1.6 -2.2 mm