US3AAF THRU US3MAF
3.0 Amp. Surface Mount Glass Passivated High Efficient Rectifiers
Features
* For surface mounted application
* Low Profile Package
* Glass Passivated Chip Junction
* High Temp Soldering: 260
℃
for 10seconds at Terminals
* Superfast Recovery Times
MIN MAX MIN MAX
A 0.173 0.193 4.40 4.90
B 0.094 0.106 2.40 2.70
C 0.130 0.146 3.30 3.70
D 0.051 0.063 1.30 1.60
E 0.035 0.043 0.90 1.10
F 0.005 0.008 0.12 0.20
G 0.031 0.047 0.80 1.20
Mechanical Dat a
* Case: SMAF Molded plastic
* Terminals: Solderable per MIL-STD-750, Method 2026
* Polarity: Indicated by cathode band
Maximum Rat i ngs and El ect r ical Characterist ics (TA=25℃ unless otherwise noted)
Note 1: Reverse Recovery Test Conditions: I
F=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 2: P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.
Version: 6.1 www.jgdsemi.com
SMAF
DIM.
INCHES
MM
A
C
D
B
G
E
F
Type Number Symbols US3AAF US3BAF US3DAF US3GAF US3JAF US3KAF US3MAF Unit
Maximum Repetitive Peak Reverse Voltage
V
RRM
50 100 200 400 600 800 1000
V
Maximum RMS Voltage
V
RMS
35 70 140 280 420 560 700 V
Maximum D.C Blocking Voltage
V
DC
50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current
I
F(AV)
A
Peak Forward Surge Current, 8.3ms single half
sine-wave
I
FSM
A
Maximum Instantaneous Forward Voltage at 3.0A
V
F
1.3 V
Maximum D.C Reverse Current @ T
J
=25℃
at Rated D.C Blocking Voltage @ T
J
=125℃
I
R
μA
Maximum Reverse Recovery Time (Note1)
Trr nS
Typical thermal resistance (Note2)
R
θJA
R
θJC
℃/W
Operating and Storage Temperature Range
T
J
/ T
STG
℃
1.0
1.7
50
75
US3AAF THRU US3MAF
3.0 Amp. Surface Mount Glass Passivated High Efficient Rectifiers
Ratings and Characteristic Curves
Version: 6.1 www.jgdsemi.com