Revision: December, 2012 www.wontop.com
Material Composition Declaration
Package Information
Package Package Weight (mg) Terminal Finish MSL Rating
KBPC-PS 20000 Nickel (Ni) N/A
Product Group
Type No. Description
GBPC1000PS – GBPC1016PS Bridge Rectifier 10A 50V – 1600V
KBPC1000PS – KBPC1012PS Bridge Rectifier 10A 50V – 1200V
GBPC1500PS – GBPC1516PS Bridge Rectifier 15A 50V – 1600V
KBPC1500PS – KBPC1512PS Bridge Rectifier 15A 50V – 1200V
GBPC2500PS – GBPC2516PS Bridge Rectifier 25A 50V – 1600V
KBPC2500PS – KBPC2512PS Bridge Rectifier 25A 50V – 1200V
GBPC3500PS – GBPC3516PS Bridge Rectifier 35A 50V – 1600V
KBPC3500PS – KBPC3512PS Bridge Rectifier 35A 50V – 1200V
GBPC4000PS – GBPC4016PS Bridge Rectifier 40A 50V – 1600V
KBPC4000PS – KBPC4012PS Bridge Rectifier 40A 50V – 1200V
GBPC5000PS – GBPC5016PS Bridge Rectifier 50A 50V – 1600V
KBPC5000PS – KBPC5012PS Bridge Rectifier 50A 50V – 1200V
Component Material Substance CAS No.
Material
Mass
(%)
Material
Mass
(mg)
Component
Mass
(%)
Component
Mass
(mg)
PPM
Die Doped Silicon* Si 7440-21-3 100.00 40.00 0.20 40.00 2000
Pb 7439-92-1 92.50 197.95 9898
Sn 7440-31-5 5.00 10.70 535
Die Attach Solder Alloy
Ag 7440-22-4 2.50 5.35
1.07 214.00
268
Cu 7440-50-8 62.00 2168.76 108438
Zn 7440-66-6 37.00 1294.26 64713
Leadframe Copper Alloy
Fe 7439-89-6 1.00 34.98
17.49 3498.00
1749
Plating Nickel Ni 7440-02-0 100.00 10.00 0.05 10.00 500
Cu 7440-50-8 99.99 2121.79 106090
Jumper Copper Alloy
Fe 7439-89-6 0.01 0.21
10.61 2122.00
11
SiO
2
14808-60-7 64.66 4665.87 233294
Epoxy Resin 29690-82-2 29.40 2121.49 106075
Brominated
Epoxy Resin
6386-73-8 2.97 214.32 10716
Encapsulation EMC
Sb
2
O
3
1309-64-4 2.97 214.32
36.08 7216.00
10716
Silica 7631-86-9 60.20 4153.80 207690
Epoxy Resin 29690-82-2 25.80 1780.20 89010
Case
Epo x y Case with
Heatsink
Al 7429-90-5 14.00 966.00
34.50 6900.00
48300
Tolerance ±10%
*Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable
level per EIA JIG-101.
Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering
calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate.
However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without
further notice.
WON-TOP ELECTRONICS
®
Revision: December, 2012 www.wontop.com
RoHS Declaration
The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics
Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), P olybrominated Biphenyls
(PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in
homogeneous materials of electronics products.
The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing,
components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these
hazardous substances in quantity levels higher than or equal to the thresholds to this directive.
Exemptions as declared for the directive are:
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
7(c)-I Lead in glass (applicable for glass passivatied silicon die).