Revision: December, 2012 www.wontop.com
Material Composition Declaration
Package Information
Package Package Weight (mg) Terminal Finish MSL Rating
R-1 181 Matte Tin (Sn) N/A
Product Group
Type No. Description
1H1 – 1H8 Diode Ultrafast 1A 50V – 1000V
1A1 – 1A7 Diode Standard 1A 50V – 1000V
Component Material Substance CAS No.
Material
Mass
(%)
Material
Mass
(mg)
Component
Mass
(%)
Component
Mass
(mg)
PPM
Die Doped Silicon* Si 7440-21-3 100.00 0.87 0.48 0.87 4807
Pb 7439-92-1 92.50 1.99 10988
Sn 7440-31-5 5.00 0.11 594
Die Attach Solder Alloy
Ag 7440-22-4 2.50 0.05
1.19 2.15
297
Cu 7440-50-8 99.91 139.98 773392
Leadframe Copper Alloy
Fe 7439-89-6 0.09 0.13
77.41 140.11
697
Plating Matte Tin Sn 7440-31-5 100.00 4.05 2.24 4.05 22376
Silica 7631-86-9 74.86 25.32 139877
Epoxy Resin 29690-82-2 23.14 7.83 43237
Sb
2
O
3
1309-64-4 1.00 0.34 1869
Encapsulation EMC
Brominated
Epoxy Resin
6386-73-8 1.00 0.34
18.68 33.82
1869
Tolerance ±10%
*Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable
level per EIA JIG-101.
Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering
calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate.
However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without
further notice.
RoHS Declaration
The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics
Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), P olybrominated Biphenyls
(PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in
homogeneous materials of electronics products.
The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing,
components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these
hazardous substances in quantity levels higher than or equal to the thresholds to this directive.
Exemptions as declared for the directive are:
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
7(c)-I Lead in glass (applicable for glass passivated silicon die).
WON-TOP ELECTRONICS
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