Key Features

Applications

• Density: 1 GB to 32 GB

• Chipkill support

• Fly-by command/address/control

bus with on-DIMM termination

• Higher bandwidth performance,

effectively up to 1866 MT/s

• Better performance at low power;

1.5V (Normal) and 1.35V

(Low Voltage)

• The Internet of Things (IoT)

• Networking systems

• Telecommunication

• Gaming

• Healthcare

• Industrial PCs

• Micro servers

Operating at 1.5V (normal) and 1.35V (low voltage) and with a transfer speed

of up to 1866 MT/s, ATP DDR3 modules deliver better performance while

consuming significantly less power than DDR2 memory.

ATP DDR3 modules are supported by the Intel® Core™ i7 Series, the AMD

AM3 Phenom™ processor, and the latest AMD Embedded Enterprise

Chipsets. DDR3 modules are not pin-compatible with the prior-generation

modules and have alignment notches preventing them from being inserted

into incompatible slots.

ATP offers DDR3 SDRAMs in a wide range of form factors and features

including SO-DIMM and Mini-DIMM with low profile, very low profile (VLP)

and ultra-low profile (ULP) options.

Intense Performance for Intense Workloads

ATP DDR3

DRAM Solutions

TEL: +886-2-2659-6368

FAX: +886-2-2659-4982

sales-apac@atpinc.com

TEL: +1-408-732-5000

FAX: +1-408-732-5055

sales@atpinc.com

ATP EUROPEATP USAATP TAIWAN(HQ)

TEL: +49-89-374-9999-0

FAX: +49-89-374-9999-29

sales-europe@atpinc.com

ATP JAPAN

TEL: +81-3-6260-0797

FAX: +81-3-6260-0798

sales-japan@atpinc.com

TEL: +86-21-5080-2220

FAX: +86-21-9687-0000-026

sales@cn.atpinc.com

ATP CHINA

202002

To learn more about this product, contact your ATP Representative.

ATP Global Footprint

www.atpinc.com

In addition to standard offerings, ATP’s DDR3 product line has

enhanced reliability options such as conformal coating for protection

against dust, chemicals, extreme temperatures and corrosion. The 30µ"

thickness of the gold finger plating ensures better durability and signal

transmission quality.

Specifications

DDR3