The 0805 series provides miniature surface mount
resettable Over-current protection with holding current
from 0.05A to 1.50A. This series is suitable for ultra
portable applications where space is at a premium and
the device current is low.
l I(hold): 0.05~1.50A
l Very high voltage surge capabilities
l Available in lead-free version
l Fast response to fault current
l RoHS compliant, Lead- Free and Halogen-Free
l Low resistance
l Compact design saves board space
l Compatible with high temperature solders
l USB peripherals
l Disk drives
l CD-ROMs
l General electronics
l Disk drives
l Set-top-box and HDMI
l Mobile Internet Device
(MID)
l PDAs / digital cameras
l Game console port
protection
l Plug and play protection
for motherboards and
peripherals
l Mobile phones - battery
and port protection
F0
80
P
Surface Mount
Device
Current Rating
5
Device size
code
TXX
DM
S X
Polytronics
Symbol
T: Thin Version
(Optional)
F: Lead-free
SMD0805P Series
POSITIVE THERMAL COEFFICIENT(PTC)
Part Number Code
Description
Features
A pplications
Test Test Conditions Accept/Reject Criteria
Resistance In still air @ 25℃ R
min
≤R≤R
max
Time to Trip Specified current，V
max
，25℃ T≤maximum Time to Trip
Hold Current 30min，at I
H
No trip
Trip Cycle Life Vmax，Imax，100cycles No arcing or burning
Trip Endurance Vmax，1hours No arcing or burning
Environmental Specifications
SMD0805P005TF
SMD0805P010TF/24
SMD0805P020TF
SMD0805P025TF
SMD0805P030TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
SMD0805P010TF
V
max
= Maximum operating voltage vice can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Ri
min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R1
max
= Maximum device resistance is measured one hour post reflow.
Terminal materials : Tin-Plated Nickle-copper
Soldering zone Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Environmental Specifications
Test Conditions Resistance Change
Passive aging 85℃,1000hours ±10%
Humidity aging 85℃/85%RH.1000 hours ±5%
Thermal shock MIL-STD-202,Method 107G
+85℃/-40℃,20times
-30% typical resistance change
Solvent Resistance MIL-STD-202,Method 215 no change
Vibration ML-STD-883C,Test Condition A No change
Physical Characteristics and Environmental Specifications