ISO 9001:2015 Quality Management System – Burlington, Ontario, Canada
SAI Global File #004008
Features and Benefits:
• 2:1 mix ratio
• Low mixed viscosity
• Exceptional salt water resistance
• Superior physical and shock resistance
• Excellent dielectric properties
• Wide range of hardness from flexible to rigid
• Resistant to aggressive thermal cycling
Applications:
• Potting and encapsulating of delicate
printed circuit boards (PCBs) and
electronic devices
• Marine applications such as deep-water
oil drilling
• Ideal for under-water cable jointing
Three types of PU potting compounds are available:
8800 (Black Flexible)
A cost-effective option for flexible potting applications.
• Excellent flexibility at low temperatures
• 5-7 minute working time
• 24 hour cure at room temperature
• Constant service temperature of -50 to 120 °C
8810 (Black Rigid)
A general-purpose, rigid potting compound that provides excellent physical protection to
delicate electronic components.
• Hardness 80 Shore D
• 45 minute working time
• 24 hour cure at room temperature
• Constant service temperature of -50 to 120 °C
• Low exotherm
8820 (High Temperature)
A general purpose, rigid potting compound that offers exceptional chemical resistance
and high service temperature.
• Hardness 73 Shore D
• 15 minute working time
• 48 hour cure at room temperature
• Excellent chemical resistance
• Constant service temperature of -50 to 150 °C
• Low exotherm
Ideal potting choice in challenging environments
Polyurethane (PU) Potting and Encapsulating Compounds
North America: 1-800-340-0772
Europe: +44 1663 362888
www.mgchemicals.com
Version # 18339 Printed in Canada
Polyurethane Potting Compound Comparison Chart
Available Packaging
2 Bottle kit
8800-375ML
8810-375ML
8820-375ML
3 Can kit
8800-10.8L
8820-10.8L
3 Pail kit
8800-60L
8820-60L
3 Can kit
8800-2.55L
8810-2.55L
8820-2.55L
8800 8810 8820
UNCURED PROPERTIES
Mix ratio by volume
2:1 2:1 2:1
CURED PROPERTIES
Application Parameters
Working life
5–7 min 45 min 15 min
Full cure @22 °C (72 °F)
24 h 24 h 48 h
Full cure @65 °C (149 °F)
30 min 1 h 2 h
Full cure @80 °C (176 °F)
25 min 45 min 1.5 h
Thermal Properties
Constant service temperature
-50 to 120 °C [-58 to 248 °F] -50 to 120 °C [-58 to 248 °F] -50 to 150 °C [-58 to 302 °F]
Glass transition temperature (T
g
)
11 °C [52 °F] 44 °C [111 °F] 44 °C [111 °F]
CTE prior T
g
86 ppm/°C [186 ppm/°F] 83 ppm/°C [181 ppm/°F] 94 ppm/°C [201 ppm/°F]
CTE after T
g
221 ppm/°C [430 ppm/°F] 210 ppm/°C [410 ppm/°F] 195 ppm/°C [382 ppm/°F]
Thermal conductivity @25 °C (75 °F)
0.32 W/(m·K) 0.25 W/(m·K) 0.27 W/(m·K)
Thermal diffusivity @25 °C (75 °F)
0.10 mm
2
/s 0.13 mm
2
/s 0.15 mm
2
/s
Specific heat capacity @25 °C (75 °F)
2.73 J/(g·K) 1.73 J/(g·K) 1.44 J/(g·K)
Physical Properties
Color
Black Black Black
Hardness
74A 80D 73D
Tensile strength
4.5 N/mm
2
[660 lb/in
2
] 10 N/mm
2
[1 500 lb/in
2
] 38 N/mm
2
[5 500 lb/in
2
]
Compressive strength
N/E 250 N/mm
2
[36 700 lb/in
2
] 295 N/mm
2
[42 800 lb/in
2
]
Lap shear (stainless steel)
4.4 N/mm
2
[640 lb/in
2
] N/E 13 N/mm
2
[1 800 lb/in
2
]
Lap shear (aluminum)
3.1 N/mm
2
[450 lb/in
2
] 7.5 N/mm
2
[1 100 lb/in
2
] 13 N/mm
2
[1 800 lb/in
2
]
Electrical Properties
Breakdown voltage @3.175 mm
46 200 V 50 900 V 47 300 V
Dielectric strength @3.175 mm
370 V/mil 407 V/mil 378 V/mil
Volume resistivity
8.4 x 10
12
Ω· cm 1.9 x 10
13
Ω· cm 1.4 x 10
13
Ω· cm
Refer to TDS for more information. N/A=Not Applicable. N/E=Not established.