RoHS Directive Compliance

PCA Electronics is ready to supply components that are in compliance with the EU RoHS Directive (EU Directive 2002/95/EC).

PCA defines “RoHS Compliant” or “Pb-Free” to mean products that are compliant with the RoHS Directive for all (six) banned

substances, including the requirement that lead (Pb) levels do not exceed 0.1% (1000ppm) by weight in homogeneous materials

unless exempted by the RoHS Directive. Maximum Concentration Values (MCV) is: 0.1% for lead, mercury, hexavalent

chromium, polybrominated biphenyls, an d polybrominated diphenylethers and 0. 01% for cadmium.

RoHS Lead-Free Identification - Components With Internal So lder Connections

This class of component includes filters and delay lines that use chip components in their construction. In order to build the

component to withstand up to 260°C peak process temperatures, Sn10Pb88Ag02 (268-299C) solder is used. While this solder is

not lead-free, it is exempted by the RoHS Directive and is currently the only cost-competitive way to meet this requirement.

These components will be marked with the suffix ‘-RC’ to denote RoHS compliance. These products do not contain any banned

substances except for lead in solders, but is exempted for lead in solder containing greater than 85% (Pb) as established by the

RoHS Directive. These parts are g enerally SMD.

Components Without Internal Solder Connections

This class of component includes open-frame transformers and components built without any internal chip components or solder

joints. These components may be supplied in a lead-free configuration. The solder used is Sn95Sb05. These components will

be marked with the suffix ‘-LF’ to denote RoHS Lead-Free status without any exemptions. These products do not contain any

banned hazardous substances above the allowable le vels set by the RoHS Directive.

RoHS 5 and RoHS 6

RoHS 5 rating denotes that all homogenous materials within the part have less that the maximum concentration value (MCV), as

defined by the RoHS Directive. RoHS 5 parts do not contain lead except in solder or terminal plating. Packaging is labeled with

the following statement: “Does not contain RoHS banned sub stan c es except Pb in solders”.

RoHS 6 rating denotes that all homogenous materials within the part have less then the maximum concentration value (MCV) for

all 6 banned substances establi she d by the RoHS Directive.

Process Information - Lead-Finish

The final lead finish for Through-Hole or SMD is Hot Tin Dip (Sn or SnCu). Hot Tin Dip has been proven to retard the growth of

Tin Whiskers. Typical lead frame plating originates with a Matte Tin over a Nickel flash barrier. Mitigation processes may include

a fused tin process shortly after plating.

Peak Process Temperature

Package thickness and volume, determines peak process temperatures ranging from 245 to 260°C for SMD IAW IPC/JEDEC (J-

STD-020C) at the rated MSL level. Through-Hole compone nts are rated for ‘wave solder’ processing only.

Moisture Sensitivity Levels (MSL’s)

Molded SMD RoHS products are rated level 4 with a floor life of 72 hours in room conditions of ≤30C/60 %RH. Open des igns are

rated level 1 with an unlimited floor life in room con ditions of ≤30C/60%RH.

Packaging & Labeling

REV F – June 10, 2006

The lowest level of packaging containing RoHS compliant components will be identified with the words “

“RoHS Compliant” printed on the bar code label or on a sepa rate label.

RoHS

COMPLIANT

Lead-free components are identified using the lead -free symbol with the words “Pb-Free”.

For reels, tubes and trays, the label will be attach ed to the vacuum-sealed bag.