46 Warshavskoe shosse. Moscow 115230 !Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
A. TEC Assembly Solder
1. Lead-free Solder Sn-Sb
(T
melt
=230ºC) - default
2. Lead-free Solder Au-Sn
(T
melt
= 280ºC) available by
request
B. TEC Ceramics
1. Al
2O3 100% - default
2. AlN 100%
3. Mixed solution (AlN/Al
2O3)
С. Ceramics Surface Options
1. Blank ceramics
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1. In-Sn, T
melt
=117°C
3.2. Sn-Bi, T
melt
= 138°C
3.3. In-Ag, T
melt
= 143°C
3.4. In, T
melt
= 157°C
3.5. Pb-Sn, T
melt
=183°C
3.6. Optional type (can be
specified by Customer)
D. Thermistor (optional)
Can be mounted to TEC cold
side. Calibration is available by
request. Various thermistor
solutions are available
E. TEC Terminal Wires
1. Blank, tinned Copper - default
2. Insulated Wires
3. Insulated, color-coded Wires
4. WB pads or WB posts
5. Flip-Chip Terminal Solution