46 Warshavskoe shosse. Moscow 115230 !Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
A. TEC Assembly Solder
1. Lead-free Solder Sn-Sb
(T
melt
=230ºC) - default
2. Lead-free Solder Au-Sn
(T
melt
= 280ºC) available by
request
B. TEC Ceramics
1. Al
2O3 100% - default
2. AlN 100%
3. Mixed solution (AlN/Al
2O3)
С. Ceramics Surface Options
1. Blank ceramics
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1. In-Sn, T
melt
=117°C
3.2. Sn-Bi, T
melt
= 138°C
3.3. In-Ag, T
melt
= 143°C
3.4. In, T
melt
= 157°C
3.5. Pb-Sn, T
melt
=183°C
3.6. Optional type (can be
speci���ed by Customer)
D. Thermistor (optional)
Can be mounted to TEC cold
side. Calibration is available by
request. Various thermistor
solutions are available
E. TEC Terminal Wires
1. Blank, tinned Copper - default
2. Insulated Wires
3. Insulated, color-coded Wires
4. WB pads or WB posts
5. Flip-Chip Terminal Solution