Product: GTXO-93
Page 1
Material Composition Data
Sub-Assembly Material Substance CAS No Mass (mg)
Sub-Assembly
GTXO-93 - 1.8V ~ 3.6V SM (VC)TCXO for GPS
% by mass
Base 1
Ceramic Al2O3 10.2491344-28-1 74.27
W 1.7957440-33-7 13.01
Ni 0.6387440-02-0 4.62
SiO2 0.50114808-60-7 3.63
Mo 0.1607439-98-7 1.16
Co 0.1597440-48-4 1.15
Au 0.0807440-57-5 0.58
Cr2O3 * 0.0771308-38-9 0.56
CaO 0.0731305-78-8 0.53
MgO 0.0681309-48-4 0.49
Base 2
Al2O3 10.2601344-28-1 71.75
W 2.1117440-33-7 14.76
Ni 0.7497440-02-0 5.24
SiO2 0.50114808-60-7 3.50
Co 0.1907440-48-4 1.33
Mo 0.1707439-98-7 1.19
Au 0.0997440-57-5 0.69
Cr2O3 * 0.0801308-38-9 0.56
CaO 0.0701305-78-8 0.49
MgO 0.0701309-48-4 0.49
Lid
Kovar (Fe/Ni/Co alloy lid Fe 1.9607439-89-6 49.25
Ni 1.0707440-02-0 26.88
Co 0.6207440-48-4 15.58
Ni 0.2807440-02-0 7.04
Mn 0.0207439-96-5 0.50
C 0.0207440-44-0 0.50
Si 0.0107440-21-3 0.25
Blank
SiO2 SiO2 0.30014808-60-7 100.00
IC
Wafer Chip (Die) Si 0.7977440-21-3 99.63
Al 0.0037429-90-5 0.38
Cu 0.0007440-50-8 0.00
As 0.0001344-28-1 0.00
P 0.0007723-14-0 0.00
B 0.0007440-42-8 0.00
Total Mass: 33.180 mg
Email: j.hems@golledge.com
John Hems
Quality Manager
Company Reg No: 2525681. Registered office: Eaglewood Park, ILMINSTER, Somerset, TA19 9DQ, England. VAT No: GB 379 3946 89.