Disclaimer:

This process guide is provided to users to assist in gaining an understanding of these materials and to quickly

establish processes for PCB fabrication. It is assumed that the users will have a technical understanding and

experience in the processes, equipment and standards related to PCB fabrication. The user will likely need to

make adjustments to account for specific requirements and their production processes.

fastRise™ EZpure

Processing Guide

August 2018

TABLE OF CONTENTS

GENERAL INFORMATION 3

STORAGE 4

HANDLING 5

INNER LAYER PREPARATION 5

BAKING 5

LAMINATION 6

QUICK START 6

PADDING AND CONFORMANCE MATERIALS 6

PRESSURE 7

TEMPERATURE 8

ADDITIONAL NOTES 9

DRILLING 10

QUICK START 10

DRILL BITS 10

CHIP LOAD 10

CUTTING SPEED 10

DWELL TIME 10

PECK DRILLING 11

HIT COUNT 11

ENTRY / BACKER MATERIALS 11

COOLANT ASSISTED DRILLING 11

LASER DRILLING / MICROVIAS 11

HOLE WALL PREPARATION 12

PLATING 12

IMAGE, DEVELOP, ETCH, STRIP 12

SOLDER MASK 12

SOLDER REFLOW 13

ROUTING / MILLING 13

The following process recommendations are based on testing and production processes at several circuit board facilities. Each facility

will have different product designs, equipment, or methods that will require modifications to these recommendations. For example,

drilling parameters, routing parameters, and artwork compensation can vary dependent on circuit board thickness, design, processes,

and equipment.

Adjustments should be based on the experience of each facility. Please contact your Taconic representative if assistance is required.