TAI-TECH
www.tai-tech.com.tw
P1
leadframe
non‐leadframe
1. Features
2. Applications
3. Dimensions
A
B
C
E
D
100
1802
A
B
C
E
D
R22
1536
4. Part Numbering
SMD Power Inductor
TMPA1206SPV-Series(N)-D
Halogen-free
Halogen
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. High reliability -Reliability test complied to AEC-Q200.
8. Operating temperature: -55~+155℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMPA 1206 SPV - 1R5 MN
- D
A B C D E
F
A: Series
B: Dimension BxC.
C: Type Standard. V:Vehicle
D: Inductance 1R5=1.5uH
E: Inductance Tolerance M=±20%
F: Code Marking: Black.1R5 and 1802(18 YY,02 WW,follow production date).
Recommend PC Board Pattern
L
G
H
L(mm) G(mm) H(mm)
14.5 8.0 5.0
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
1R5
1802
Series A B C D E Inductance
TMPA1206 13.5±0.5 12.6±0.2 5.7±0.3 2.3±0.3
4.0±0.3 1.50uH
4.7±0.3
0.36uH and below
3.30uH and above
Unit: mm
TAI-TECH
www.tai-tech.com.tw
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
( A ) Irms.
Saturation
Current DC
(A)I sat
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
Type
Typ Max Typ Max
TMPA1206SPV-R33MN-D 0.33 63.0 52.0 70.0 62.0 0.55 0.66
non-leadframe
TMPA1206SPV-R36MN-D 0.36 60.0 50.0 70.0 60.0 0.65 0.80
non-leadframe
TMPA1206SPV-1R5MN-D 1.50 28.0 24.0 32.0 27.0 2.40 3.00
non-leadframe
TMPA1206SPV-3R3MN-D 3.30 21.0 18.0 28.0 24.0 5.3 6.5
leadframe
TMPA1206SPV-8R2MN-D 8.20 13.5 12.0 17.0 15.5 13.5 16.0
leadframe
TMPA1206SPV-100MN-D 10.0 12.0 10.5 16.0 14.5 15.5 18.6
leadframe
TMPA1206SPV-150MN-D 15.0 10.0 8.50 10.0 9.00 24.0 29.0
leadframe
TMPA1206SPV-220MN-D 22.0 8.00 7.00 9.00 8.00 31.2 37.5
leadframe
TMPA1206SPV-330MN-D 33.0 6.50 5.50 7.80 6.70 56.0 68.0
leadframe
TMPA1206SPV-470MN-D 47.0 5.20 4.50 6.70 5.50 76.0 88.0
leadframe
TMPA1206SPV-680MN-D 68.0 4.50 3.70 5.80 5.00 103 124 leadframe
TMPA1206SPV-101MN-D 100 3.20 2.80 5.00 4.00 162 195 leadframe
TMPA1206SPV-151MN-D 150 2.60 2.20 4.10 3.20 270 325 leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilen t33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil tempera ture rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.