TAI-TECH
1. Features
2. Applications
3. Dimensions
4. Part Numbering
TMHC1707SP-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency.
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
8.
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMHC
1707
SP
-
100
MN
-
D
A
B
C
D
E
F
A: Series
B: Dimension BxC.
C: Type Standard.
D: Inductance 100=10.0uh.
E: Inductance Tolerance M=±20%.
F: Code Marking: Black.100 and 1933H (19:YY, 33:WW, follow production date, H:P/N).
SMD Power Inductor
Recommend PC Board Pattern
L
G
H
L(mm)
G(mm)
H(mm)
18.5
11.0
12.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.17mm and above.
Series
A
A`
B
C
D
E
TMHC1707
17.8±0.5
16.9±0.3
16.9±0.3
6.7±0.3
2.3±0.3
11.9±0.3
Unit:mm
Halogen-free
Halogen
100
1933H
TAI-TECH
5. Specification
6. Material List
NO
Items
Materials
1
Core
Alloy Powder .
2
Wire
Polyester Wire or equivalent.
3
Clip
100% Pb free solder(Ni+Sn---Plating)
4
Ink
Halogen-free ketone
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
I rms ( A )
Saturation
Current DC
I sat ( A )
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
Typ
Max
Typ
Max
TMHC1707SP-R47MN-D
0.47
60
55
115
100
0.75
0.83
TMHC1707SP-1R0MN-D
1.00
48
43
68
60
1.30
1.50
TMHC1707SP-1R5MN-D
1.50
42
37
55
48
1.80
2.10
TMHC1707SP-2R2MN-D
2.20
40
35
45
40
2.50
2.80
TMHC1707SP-3R3MN-D
3.30
28
25
40
35
3.50
3.90
TMHC1707SP-4R7MN-D
4.70
26
23
37
32
4.80
5.50
TMHC1707SP-5R6MN-D
5.60
24
21
35
31
5.90
6.80
TMHC1707SP-6R8MN-D
6.80
22
18
30
25
8.40
9.20
TMHC1707SP-8R2MN-D
8.20
18
15
28
24
9.60
10.8
TMHC1707SP-100MN-D
10.0
17
14
25
21
11.6
13.0
TMHC1707SP-150MN-D
15.0
14
12.5
23
20
16.5
19.5
TMHC1707SP-180MN-D
18.0
13.0
11.0
21
18.0
20.0
24.0
TMHC1707SP-220MN-D
22.0
12
10
19
17
24.0
27.6
TMHC1707SP-270MN-D
27.0
11.3
9.5
17.0
15.0
31.0
36.0
TMHC1707SP-330MN-D
33.0
10.7
9.0
15
13
36.0
42.0
TMHC1707SP-470MN-D
47.0
8.7
7.0
13
11
46.0
53.0
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δ
T of 40
℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
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