Surface Mount Resettable PTCs
Revision October 18, 2013
1 / 4
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
SMD1206 Series
UN Semiconductor Co., Ltd. www.unsemi.com.tw
The SMD1206 Series PTC provides surface mount
over-current protection for applications where space is at a
premium and resettable protection is desired.
u RoHS compliant, Lead-Free and Halogen-Free
u Fast time-to-trip
u Compact design saves board space
u Low resistance
u Low-profile
u PC motherboard - plug and play protection
u Mobile phones - battery and port protection
u Game console port protection
u USB peripherals
u Disk drive
u PDAS / digital cameras
u Power ports
u General electronics
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
Maximum Time
To Trip
Resistance
Part Number
I
hold
(A)
I
trip
(A)
V
max
(Vdc)
I
max
(A)
P
dtyp.
(W)
Current
(A)
Time
(Sec.)
R
min
(Ω)
R
1max
(Ω)
SMD1206-005 0.05 0.15 60 10 0.4 0.25 1.50 3.600 50.000
SMD1206-010 0.10 0.25 60 10 0.4 0.50 1.00 1.600 15.000
SMD1206-012 0.12 0.29 60 100 0.4 0.50 1.00 1.600 15.000
SMD1206-020 0.20 0.46 30 100 0.6 8.00 0.08 0.350 2.700
SMD1206-025 0.25 0.50 16 100 0.6 8.00 0.08 0.350 2.500
SMD1206-025/18V 0.25 0.5 18V 100 0.6 8.00 0.08 0.350 2.500
SMD1206-035 0.35 0.75 6 100 0.6 8.00 0.10 0.250 1.300
SMD1206-050 0.50 1.00 6 100 0.6 8.00 0.10 0.150 0.700
SMD1206-050/13.2V
0.50 1.00 13.2 100 0.6 8.00 0.10 0.150 0.700
SMD1206-075 0.75 1.50 6 100 0.6 8.00 0.20 0.090 0.500
SMD1206-100 1.00 1.80 6 100 0.6 8.00 0.30 0.055 0.270
SMD1206-110/16V 1.10 2.20 16 100 0.6 8.0 0.30 0.055 0.270
SMD1206-110 1.10 2.20 6 100 0.6 8.00 0.30 0.050 0.250
SMD1206-150 1.50 3.00 6 100 0.8 8.00 1.00 0.040 0.130
SMD1206-200 2.00 3.50 6 100 0.8 8.00 1.50 0.018 0.080
I
hold
= Hold current: maximum current device will pass without tripping in 23°C still air.
I
trip
= Trip current: minimum current at which the device will trip in 23°C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
dtyp.
= Power dissipated from device when in the tripped state at 23°C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 23°C measured one hour after tripping.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
Applicable
Description
Features
Surface Mount Resettable PTCs
Revision October 18, 2013
2 / 4
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
SMD1206 Series
UN Semiconductor Co., Ltd. www.unsemi.com.tw
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (T
S
max to T
P
)
3°C/second max.
Preheat :
Temperature Min (T
S
min)
Temperature Max (T
S
max)
Time (
T
S
min to
T
S
max)
150°C
200°C
60
-
180 seconds
Time maintained above:
Temperature(TL)
Time (Tl)
217°C
60-150 seconds
Peak/Classification Temperature(T
P
):
260°C
Time within 5°C of actual peak:
Temperature
20-40 seconds
Ramp-down Rate:
6°C/ second max.
Time 25°C to Peak Temperature
8 minutes max.
Note: All temperatures refer to of the package, measured on the package body surface.
5
Terminal pad material Pure Tin
Soldering Characteristics Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
Temperature Rerating
Chart
–
I
hold
(A)
Soldering Parameters
Material
Specifications
Ramp-down
Preheat
Critical Zone
T
L
to T
P
Time to peak temperature
(t 25℃ to peak)
T
P
T
L
T
S(max)
T
S(min)
25
Temperature
Ramp-up
Time
Temperature Rerating Curve
Average Time Current Curves
Ambient Temperature (°C)