Au HA3
Low Loop
•
High Reliability
•
Bumping
Diameter Microns (µm) 17.5 20 23 25 30 33 38 50
Mils 0.7 0.8 0.9 1.0 1.2 1.3 1.5 2.0
Elongation % 2 –6 2 –6 2 –6 2 –8 2 –8 3 –8 3 –8 3 –8
Breaking Load cN > 5 > 6 > 8 > 10 > 15 > 18 > 22 > 40
For other diameters, please contact Heraeus Bonding Wires sales representative.
Recommended Technical Data of Au HA3
Au HA3 Benefits
High reliability wire type
Increased strength, high loop stiffness
Very good pull strengths and shear
Long & low loop geometries
Optimum stabilized phase formation
High thermal stability
5.0
Au HA3 Type
In contrast to doped Au wires,
alloyed wire types contain a low
percentage of alloying elements.
This results in markedly higher wire
strength, shorter heat affected zones
and better thermal stability without a
significant increase in electrical resist-
ance. The increased wire strength,
while maintaining all other mechani-
cal properties, permits a reduction of
wire diameter together with a marked
saving in precious metal costs.
Areas of application
High frequency bonding
Low temperature bonding
Low- and long-loop bonding
High speed bonding
Ultra fine pitch bonding
Ball bumping
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
Breaking Load vs. Elongation
Elongation (%)
Breaking Load (cN)
0.0
10.0
ø 50 µm
ø 38 µm
ø 32 µm
ø 25 µm
ø 22 µm
ø 20 µm
ø 17.5 µm
HA3 Characteristics for 25 µm diameter
90
80
70
60
50
40
30
20
10
0
Heat Affected Zone (HAZ)
Wire diameter (mil)
Length of HAZ (µm)
0.8 1.0 1.2
600
500
400
300
200
100
0
Breaking Load vs. Elongation
Elongation
Tensile strength (N / mm
2
)
2% 4% 8%
Superior Reliability
Widest Bonding Highest Looping
Window Performance
Gold Wire Segmentation by Properties
Superior Reliability
Widest Bonding Highest Looping
Window Performance
Superior Reliability
Electrical Performance
Widest Bonding Highest Looping
Window Performance
High
Average
Sensitive pad
structure
High Loop / Low Loop
Non-Gold Elements < 100 ppm
Elastic Modulus > 90 GPa
Heat Affected Zone (HAZ) 60 – 100 µm
Melting Point 1063 °C
Density 19.2 g / cm³
Heat Conductivity 3.03 W / cmK
Electrical Resistivity 2.9 µΩ-cm
Coeff. of Linear Expansion (20 – 100 °C) 14.2 ppm / K
Fusing Current for 25 µm, dia 10 mm length (in air) 0.345 A
60
50
40
30
20
10
0
High Temperature Strength (HTS)
Wire diameter (µm)
Breaking Load (cN) Elongation (%)
25 32 50
38
0%
4%
8%
FAB diameter
0.8 mil x 1.65
1.0 mil x 1.49
1.2 mil x 1.75
N, Layout: HET14013-0516-1
The data given here is valid. We reserve the right to make technical alterations.
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12-14
63450 Hanau, Germany
www.heraeus-electronics.com
Americas
Phone +1 610 825 6050
electronics.americas@heraeus.com
Asia Pacific
Phone +65 6571 7677
electronics.apac@heraeus.com
China
Phone +86 21 3357 5457
electronics.china@heraeus.com
Europe, Middle East and Africa
Phone +49 6181 35 3069
+49 6181 35 3627
electronics.emea@heraeus.com
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.