Main Applications
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AW-28
Gold Bonding Wire Series
AW-28 Benefits
High strength wire, suitable for
standard-intermediate loop formation
Consistent fine grain size formation
in the Heat Affected Zone (HAZ)
at ball neck.
Usable for gold ball bonding
and gold wedge bonding
Usable for all existing high speed
wire bonders
Usable on a wide range
of package types
Diameter Microns 18 20 23 25 28 30 32 33 35 38 50
Mils 0.7 0.8 0.9 1.0 1.1 1.2 1.25 1.3 1.4 1.5 2.0
Recommended Specs
Elongation (%) 2 –6 2 –6 2 –6 2 –6 2 –6 2 –7 2 –7 2 –7 2 –7 2 –7 4 – 12
Breaking Load (g) 3 –6 3 –8 5 – 10 7 – 11 9 – 15 10 – 17 12 – 19 13 – 20 15 – 23 16 – 30 35 – 48
For other diameters, please contact Heraeus Bonding Wires sales representative.
Recommended Technical Data of AW-28
AW-28 Characteristics
Starting gold raw materials 99.999 % purity prior to controlled
doping/stabilizing stage
Non-Gold Elements < 100 ppm
Density 19.32 g/cm
3
Melting Point 1063 °C
Electrical Resistivity @ 20 °C 2.3 µ⍀-cm
Thermal Conductivity @ 20 °C 3.17 W/cm
.
K
Electrical Conductivity @ 20 °C 75 % IACS
Heat Affected Zone (HAZ) Length [in micron]
Wire Size FAB Size Min Max
25.00 50.00 139 150
25.00 76.00 180 195
33.00 68.58 190 205
33.00 104.00 278 296
Measurement accuracy within ± 20 µm
Bondability of 1st Bond Results
Mean (n-1) Min Max n
Ball Shear Force (g) 69.9 3.1 62.0 74.5 25
Ball Shear Strength (g/mil
2
) 6.7 0.4 6.0 7.6 25
Bondability of 2nd Bond Results (g)
Mean (n-1) Min Max n
14.0 0.8 12.7 15.4 25
Mid-Span Pull Results (g)
Mean (n-1) Min Max n
8.3 0.4 7.9 9.2 25
Gold Wire Segmentation by Properties
Superior Reliability
Widest Bonding Highest Looping
Window Performance
Superior Reliability
Widest Bonding Highest Looping
Window Performance
Superior Reliability
Electrical Performance
Widest Bonding Highest Looping
Window Performance
High
Average
Sensitive pad
structure
High Loop / Low Loop
Bonding Conditions:
Wire diameter: 33 µm
Wire bonder: K&S 1488 turbo
Package type: PLCC 68 leads
Die metallization: AlSi (1%) Cu (0.5%)
Leadframe: Ag plated Cu
Wire span: 3.2 – 4 mm
Loop height range: 229 µm ± 25 µm
Bonding temperature: 240ºC
Capillary: 41413-0013-335
1st Bond Parameters
Bond force: 65 g
Bond power: 75 mWatt
Bond time: 15 mSec
Mean ball size: 93 µm
2nd Bond Parameters
Bond force: 52 g
Bond power: 60 mWatt
Bond time: 15 mSec
N, Layout: HET14007-0516-1
The data given here is valid. We reserve the right to make technical alterations.
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12-14
63450 Hanau, Germany
www.heraeus-electronics.com
Americas
Phone +1 610 825 6050
electronics.americas@heraeus.com
Asia Pacific
Phone +65 6571 7677
electronics.apac@heraeus.com
China
Phone +86 21 3357 5457
electronics.china@heraeus.com
Europe, Middle East and Africa
Phone +49 6181 35 3069
+49 6181 35 3627
electronics.emea@heraeus.com
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the
date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.