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AW-14
Gold Bonding Wire for Universal Use
AW-14 Benefits
Large process window for robust,
highly portable mass production
Proven in the widest range of applications
Excellent low loop stability and high
strength properties for a variety of
advanced packaging requirements
Consistent ball size and fine-grain, short
heat affected zone (HAZ) at ball neck
Easily optimized wire available in
diameters down to 17.5 µm (0.7 mil.)
Compatible with all ball and wedge
bonding equipment
For the last half decade, AW-14
has been an industry mainstay for
applications involving low loops such
as those found in TQFP, CSP, TSOP
and smart card assembly. Consistent
fine grain size and a short heat
affected zone allow low heights
(as low as 100 µm) and long spans
(up to 7 mm). This versatile 4N wire
(99.99 % Au) provides very wide
parameter window and can be used
on virtually all types of equipment
for both ball and wedge bonding.
Easy to optimize parameters
for a wide range of packages
AW-14 lends itself to a variety
of devices (from discretes through
TSOPs, QFPs and BGAs for single
die, stacked die and die-to-die
applications) due to a high modulus
and stable properties. AW-14’s large
process windows provide robust,
highly portable bonding in mass
production, making it one of the
industry’s easiest wires to use.
Bonding Conditions: Wire diameter: 25 µm (1.0 mils)
Wire bonder: K&S 1488 turbo
.
Package type: 208-lead
QFP
.
Die metallization: AlSi (1%) Cu (0.5 %)
.
Lead -
frame: Ag-plated Cu
.
Wire span: 4 – 7 mm
.
Bonding
temperature: 220 °C
.
Capillary: 414Fa-0310-R35
AW-14 Low Loop Consistency
All dimensions in microns
Wire Loop Std
Size Height Dev Min. Max. n
25 168 4.0 160 168 20
25 150 2.3 146 154 32
33 152 5.8 137 168 100
Diameter Microns 18 20 23 25 28 30 32 33
Mils 0.7 0.8 0.9 1.0 1.1 1.2 1.25 1.3
Recommended Spec for Ball Bonding
Elongation (%) 2 –5 2 –6 2 –6 2 –6 2 –6 2 –7 2 –7 2 –7
Breaking Load (g) 3 –6 4 –9 7 – 12 8 – 13 10 – 15 12 – 18 14 – 21 15 – 22
In-Line Pad Pitch (µm)
Min. In-Line Pad Pitch 65 70 80
For other diameters, please contact Heraeus Bonding Wires sales representative. Range of recommended pad pitch with corresponding wire diameter.
Recommended Technical Data of AW-14
AW-14 Characteristics for 25 µm diameter
Non-Gold Elements < 100 ppm
Elastic Modulus ⵑ 80 GPa
Heat Affected Zone (HAZ) 50 – 190 µm
Melting Point 1063 °C
Density 19.32 g/cm
3
Heat Conductivity 3.17 W/cm
.
K
Electrical Resistivity 2.3 µΩ-cm
Coeff. of Linear Expansion (20 – 100 °C) 14.2 ppm/K
Fusing Current for 25 µm, dia 100 mm length (in air) 0.37 A
Gold Wire Segmentation by Properties
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
20/40 20/60 25/50 25/75 30/60 30/90
Neck Strength (g)
avg. +3s
avg.
avg. -3s
Neck Strength
Mold Sweep Resistance
Auto-Gang Pot Molding
Sumitomo Compound EME 7320
Wire diameter 30 µm, wire span up to 7 mm
Spec. limit 8 % of wire span
DAP Wire Std
Size Span Avg. Dev. Min. Max.
9 x 9 5 mm 1.2 0.40 0.3 2.1
10.5 x 10.5 6 mm 1.9 0.67 0.8 3.3
12 x 12 7 mm 2.0 0.59 0.8 3.4
Data is in % of wire span, measured at 90 ° positioned to gate.
Superior Loop Linearity
Superior Reliability
Widest Bonding Highest Looping
Window Performance
Superior Reliability
Widest Bonding Highest Looping
Window Performance
Superior Reliability
Electrical Performance
Widest Bonding Highest Looping
Window Performance
High
Average
Sensitive pad
structure
High Loop / Low Loop
N, Layout: HET14005-0516-1
The data given here is valid. We reserve the right to make technical alterations.
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12-14
63450 Hanau, Germany
www.heraeus-electronics.com
Americas
Phone +1 610 825 6050
electronics.americas@heraeus.com
Asia Pacific
Phone +65 6571 7677
electronics.apac@heraeus.com
China
Phone +86 21 3357 5457
electronics.china@heraeus.com
Europe, Middle East and Africa
Phone +49 6181 35 3069
+49 6181 35 3627
electronics.emea@heraeus.com
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.