Material Composition Declaration
Company Name Issue Date: 9/9/2019
Contact Name: Contact Title:
VP Quality
Contact Phone: Contact Email:
yanping.ma@epc-co.com
Part Weight: Type of Product: eGaN FET
Weight
Mass Sum Mass
(mg) (%) (%) (ppm)
Silicon 7440-21-3
1.6035 87.2562 872562
Silicon oxide 7631-86-9
0.0063 0.3454 3454
Silicon nitride 12033-89-5
0.0021 0.1143 1143
Gallium nitride 25617-97-4
0.0076 0.4155 4155
Aluminum 7429-90-5
0.0066 0.3580 3580
Aluminum nitride 24304-00-5
0.0018 0.0992 992
Titanium 7440-32-6
0.0002 0.0136 136
Titanium nitride 25583-20-4
0.0009 0.0508 508
Copper 7440-50-8
0.0002 0.0118 118
Tungsten 7440-33-7
0.0005 0.0287 287
Polyimide
0.0108 0.5854 5854
Titanium 7440-32-6
0.0001 0.0065 65
Nickel
7440-02-0 0.0000 0.0000 0
Vanadium
7440-62-2 0.0000 0.0000 0
Copper 7440-50-8
0.0100 0.5447 5447
Tin 7440-31-5
0.1785 9.7122 97122
Silver 7440-22-4
0.0075 0.4068 4068
Copper 7440-50-8
0.0009 0.0508 508
Sum in total: 1.8377 100.0000 100.0000 1000000
Solder Bump
10.1699
Construction
Element
Substance
CAS No.
If Applicable
Chip
89.2789
Under Bump Metal
0.5512
EPC2216
Efficient Power Conversion (EPC)
Yanping Ma
(310) 615-0283
1.8 mg
Note:
The substance content disclosed herewith is approximate and is based on engineering calculation. Statements are based on our present
knowledge and may subject to change at any time due to technical requirements and development. EPC may update this document without
notification. Statement may not include information regarding the minute quantities of dopant and metal materials in the electrical devices