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More Choices, Greater Security
…no supply chain issues and top performance with
IGBT M7 flow E and MiniSKiiP
®
power modules
Dr. Evangelos Theodossiu, Senior Product Marketing Manager, Vincotech GmbH Unterhaching
Hadiuzzaman Syed, Technical Marketing Manager, Vincotech GmbH Unterhaching
There is trouble ahead for the electronics industry when demand spikes and supply slumps
because semiconductor suppliers are slow to invest in production capacity. This would
minimize customers' growth opportunities. A smart multi-sourcing strategy is the solution for
this kind of problem. It is obvious that the best time to implement such a strategy is not when
pending line-down situation occurs because of supply chain issue. Furthermore a proactive
approach is needed to research possibilities and to establish resources for evaluation and
qualification of second sources. Vincotech developed the new IGBT M7 flow E1/E2 and
MiniSKiiP
®
products with two priorities in mind – to deliver the benefits of multi-sourcing while
raising the performance bar for these product types.
A multi-sourcing strategy could certainly make the supply chain more reliable, but only if it
factors both mechanical and electrical components into the design. Vincotech covered both
aspects: The Company rolled out the new flow E standard industry package for low-power
motor drive applications to complement its standard package portfolio besides the already
existing MiniSKiiP
®
package. Both MiniSKiiP
®
and flow E1/E2 packages ship with the recently
released IGBT M7 chip technology. The key features and benefits of the new package and the
new chip technology will be discussed in detail.
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flow E and MiniSKiiP
®
package:
Figure 1: Industry standard flow E and MiniSKiiP
®
packages for low power motion control
applications
Vincotech developed the flow E1/E2 package as an alternative to the easy package. It is a
12 mm-high low inductive housing with two lateral mounting screws, either press-fit pins or
solder pins and no baseplate. The housing’s footprint and pin-out are fully compatible with
standard topologies. Customers can use the same heat sink and a printed circuit board (PCB)
with identical specifications. On the other hand effort was putted while development to raise
the performance bar. The housing design were optimized for an excellent mechanical contact
on the heat sink. In course of this optimization the low thermal resistance phase change
material was possible to be utilized for this package for the first time. The result is a superior
thermal performance compared to the competition. A pressure distribution benchmark for
flow E1/E2 in comparison with a competitor easy 1b/2b module can be seen in figure 2. Both
modules were screwed down onto a flat heat sink. This bench test took the easy module’s
mounting instructions and TIM thickness into account. The optimized flow E housing clearly
distributes pressure much better than the competing product. This means it can take a thinner
layer of phase change material to mitigate the risk of over-stressing the direct copper bonding
(DCB). Its superior thermal performance ���up to 15% better than the competition – translates
directly into greater reliability.