Most electronic components produce heat when in use. The unwanted heat

has to be dissipated away from the components to maintain performance and

avoid premature failure of the components or device. The need for efficient

transfer of heat has become a key design requirement as components continue

to reduce in size and increase in power, this is particularly apparent with

microchip processors, LED's and power packs.

Designs will vary but in essence all involve some form of heat sink which may

be a specialised unit or simply the enclosure or base plate. There needs to be an

efficient pathway for the heat to travel between this and the components in

order to dissipate the heat. It is the interface between the heat sink and

component that calls for the use of thermal transfer compounds, without their

use any air gaps that exist regardless of size will act as an insulator and prevent

heat transfer (see Fig1 & Fig 2). Silicone polymers are loaded with microscopic,

thermally conductive particles, the combination of the two, produce adhesives

and other compounds that give superior performance in terms of flexibility,

elongation and heat resistance when compared with many other organic and

epoxy based products.

Selection of a suitable thermal transfer compound will depend upon the

required level of thermal conductivity, mechanical constraints, operating

environment and production methods. Within the SILCOTHERM range

there is a wide selection to choose from.

Typical Applications

Computer's

Automotive electronics

LED's

Power packs

PCB assembly

Sensors

Radiator systems

Photovoltaic junction boxes

Principles of Thermal Transfer Compounds

HEAT SINK

PROCESSOR

Fig 1

Fig 2

SILICONE

COMPOUND

AIR GAPS