Key Features
Applications
• Density: 1 GB to 32 GB
• Chipkill support
• Fly-by command/address/control
bus with on-DIMM termination
• Higher bandwidth performance,
effectively up to 1866 MT/s
• Better performance at low power;
1.5V (Normal) and 1.35V
(Low Voltage)
• The Internet of Things (IoT)
• Networking systems
• Telecommunication
• Gaming
• Healthcare
• Industrial PCs
• Micro servers
Operating at 1.5V (normal) and 1.35V (low voltage) and with a transfer speed
of up to 1866 MT/s, ATP DDR3 modules deliver better performance while
consuming significantly less power than DDR2 memory.
ATP DDR3 modules are supported by the Intel® Core™ i7 Series, the AMD
AM3 Phenom™ processor, and the latest AMD Embedded Enterprise
Chipsets. DDR3 modules are not pin-compatible with the prior-generation
modules and have alignment notches preventing them from being inserted
into incompatible slots.
ATP offers DDR3 SDRAMs in a wide range of form factors and features
including SO-DIMM and Mini-DIMM with low profile, very low profile (VLP)
and ultra-low profile (ULP) options.
Intense Performance for Intense Workloads
ATP DDR3
DRAM Solutions
TEL: +886-2-2659-6368
FAX: +886-2-2659-4982
sales-apac@atpinc.com
TEL: +1-408-732-5000
FAX: +1-408-732-5055
sales@atpinc.com
ATP EUROPEATP USAATP TAIWAN(HQ)
TEL: +49-89-374-9999-0
FAX: +49-89-374-9999-29
sales-europe@atpinc.com
ATP JAPAN
TEL: +81-3-6260-0797
FAX: +81-3-6260-0798
sales-japan@atpinc.com
TEL: +86-21-5080-2220
FAX: +86-21-9687-0000-026
sales@cn.atpinc.com
ATP CHINA
1811
To learn more about this product, contact your ATP Representative.
ATP Global Footprint
www.atpinc.com
In addition to standard offerings, ATP’s DDR3 product line has enhanced reliability options such as
conformal coating for protection against dust, chemicals, extreme temperatures and corrosion. The 30µ"
thickness of the gold finger plating ensures better durability and signal transmission quality.
Specifications
DDR3
Type
LRDIMM RDIMM UDIMM ECC UDIMM SO-RDIMM
Data Rate Speed
(MT/s)
1600
1333
1066
1866
1600
1333
1066
1866
1600
1333
1066
1866
1600
1333
1066
1600
1333
1066
Density
32GB
1 GB / 2 GB / 4 GB / 8 GB /
16 GB / 32 GB
1 GB / 2GB / 4 GB / 8 GB /
16 GB
1 GB / 2 GB / 4 GB / 8 GB /
16 GB
2 GB / 4 GB / 8 GB
Voltage
1.35V / 1.5V
PCB Height
• Low profile
• Low profile
• VLP options: 0.74��� height
• ULP options: below 0.74”
height
• Low profile
• VLP options: 0.74” height
• Low profile
• VLP options: 0.74” height
• Low profile
Working Temperature
0-85°C / -40-95°C
Golden Finger
30µ
DDR3
Type
SODIMM ECC SODIMM Mini-RDIMM ECC Mini-UDIMM
Data Rate Speed
(MT/s)
1866
1600
1333
1066
1866
1600
1333
1066
1600
1333
1066
1600
1333
1066
Density
1 GB / 2 GB / 4 GB / 8 GB /
16 GB
1 GB / 2 GB / 4 GB / 8 GB /
16 GB
2 GB / 4 GB / 8 GB /16GB 2 GB / 4 GB / 8 GB / 16 GB
Voltage
1.35V / 1.5V
PCB Height
• Low profile • Low profile
• Low profile
• VLP options: 0.74" height
• ULP options: below 0.74”
height
• Low profile
• VLP options: 0.74" height
• ULP options: below 0.74”
height
Working Temperature
0-85°C / -40-95°C
Golden Finger
30µ
Industrial Temperature
Anti-Sulfur Resistors
Thicker Gold Finger
TDBI
Conformal Coating