Approval sheet
Page 2 of 9 ASC_RFANT5220110A2T_V03 May. 2013
FEATURES
1. Surface Mounted Devices with a small dimension of 5.2 x 2.0 x 1.1 mm
3
meet future miniaturization trend.
2. Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with
system design as well as beautifying the housing of final product.
3. High Stability in Temperature / Humidity Change
APPLICATIONS
1. Bluetooth
2. Wireless LAN
3. HormRF
4. ISM band 2.4GHz wireless applications
CONSTRUCTION
Figure Symbol Dimension (mm)
L
5.20 ± 0.20
W
2.00 ± 0.20
T
1.15 ± 0.10
A
0.40 ± 0.25
PIN
Connection
1 Feeding
2 Identification Mark
3 Soldering terminal
P1
P3
P2