Approval sheet
Page 2 of 9 ASC_RFANT5220110A0T_V15 Jun. 2014
FEATURES
1.
Surface Mounted Devices with a small dimension of 5.2 x 2.0 x 1.1 mm
3
meet future miniaturization trend.
2.
Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as
well as beautifying the housing of final product.
3.
High Stability in Temperature / Humidity Change
APPLICATIONS
1.
Bluetooth
2.
Wireless LAN
3.
HormRF
4.
ISM band 2.4GHz wireless applications
CONSTRUCTION
DIMENSIONS
Figure Symbol Dimension (mm)
L
5.20 ± 0.20
W
2.00 ± 0.20
T
1.15 ± 0.10
A
0.40 ± 0.25
PIN
Connection
1 Feeding
2 Identification Mark
3 Soldering terminal
P1
P3
P2