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ENS210
Content Guide
Application Note • PUBLIC
AN000391 • v4-00 • 2018-Oct-11
19 │ 2
Content Guide
1 General Description ....................... 3
2 Sensing Modality ........................... 4
3 Circuit Design Considerations ..... 5
4 PCB Layout Considerations ......... 6
5 Casing Design Considerations ..... 8
6 Low Power Design
Considerations ............................ 10
7 ENS210 Handling ......................... 11
8 ENS210 SMT Nozzle Selection .... 12
9 Effect of Soldering on
Temperature Readout .................. 13
10 Long Term Drift (LTD) for RH
Sensor .......................................... 14
11 Real Time Drift (RTD) for RH
Sensor .......................................... 15
12 Maximum Supply Current ........... 16
13 Summary ...................................... 17
14 Revision Information ................... 18
15 Legal Information ........................ 19