TAI-TECH
P1
leadframe
non‐leadframe
1. Features
2.Applications
3. Dimensions
A
B
C
E
D
1537
T
A`
2R2
A
B
C
E
D
1R0
1537
A`
T
4. Part Numbering
TMPA1004SV-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6.
100% Lead(Pb)-Free and RoHS compliant.
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMPA 1004
SV
- 1R0 MN
- D
A B C D E F
A: Series
B: Dimension
BxC
C: Type Standard.
D: Inductance R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
F:
Code Marking: Black.1R0 and 1537(15 YY, 37 WW,follow production date).
Pb-free
Pb
SMD Power Inductor
Halogen-free
Halogen
Recommend PC Board Pattern
L
G
H
Series A A` B C D T E Inductance
TMPA1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2
2.0±0.3
0~0.2
2.5±0.3
0.56~1.50uH among
3.0±0.3
0.47uH and
below
2.20uH and above
Unit: mm
L(mm) G(mm) H(mm)
12.5 5.4 3.5
Note:
1.Only for reference.
2. Recommend solder paste
thickne
ss at 0.15mm and above
TAI-TECH
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
I rms.(A)
Saturation
Current DC
I sat. (A)
DCR
(mΩ)Typ
DCR
(mΩ)Max
Type
Typ Max Typ Max
TMPA1004SV-R15YN-D
0.15±30% 44 38 82 75 0.5 0.6
non-leadframe
TMPA1004SV-R22MN-D
0.22 36 33 70 60 0.72 0.83
non-leadframe
TMPA1004SV-R36MN-D
0.36 33 29 51 45 1.05 1.18
non-leadframe
TMPA1004SV-R47MN-D
0.47 32 28 46 40 1.3 1.5
non-leadframe
TMPA1004SV-R56MN-D
0.56 25 23 34 29 1.6 1.8
non-leadframe
TMPA1004SV-R68MN-D
0.68 23 20 31 28 1.9 2.2
non-leadframe
TMPA1004SV-1R0MN-D
1.00 20 18 29 26 2.9 3.25
non-leadframe
TMPA1004SV-1R5MN-D
1.50 17.5 16 26 22 3.7 4.2
non-leadframe
TMPA1004SV-2R2MN-D
2.20 15 13 20 16 5.8 6.7
leadframe
TMPA1004SV-3R3MN-D
3.30 11 10 17.5 14 10.5 11.8
leadframe
TMPA1004SV-4R7MN-D
4.70 8.8 8 15.2 13 15.8 19
leadframe
TMPA1004SV-5R6MN-D
5.60 8 7.2 14.1 11.5 19 22.8
leadframe
TMPA1004SV-6R8MN-D
6.80 7.8 6.8 12.2 11 22 24.5
leadframe
TMPA1004SV-100MN-D
10.0 7.5 6.1 8.6 7.5 27 30
leadframe
TMPA1004SV-150MN-D
15.0 6.25 5 7 6 41 45
leadframe
TMPA1004SV-220MN-D
22.0 5 4.1 6.2 5.5 58 66
leadframe
TMPA1004SV-330MN-D
33.0 4.4 3.5 5.5 5 84 91
leadframe
TMPA1004SV-470MN-D
47.0 3.5 3 4 3.7 125 143
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.