TAI-TECH
leadfram
non-leadfram
1. Features
2. Applications
3. Dimensions
4. Part Numbering
TMHC1004S-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6.
100% Lead(Pb)-Free and RoHS compliant.
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
Pb-free
Pb
SMD Power Inductor
Halogen-free
Halogen
TMHC 1004 S - 4R7 MN
- D
A B C D E
F
A: Series
B: Dimension BxC
C: Type Standard.
D: Inductance R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
F: Code Marking: Black.4R7 and 1713H (17:YY, 13:WW, follow production date, H:P/N).
Recommend PC Board Pattern
L
G
H
Series A A` B C D T E Inductance
2.5±0.3
0.68uH
TMHC1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2
2.0±0.3
0~0.2
3.0±0.3
0.47uH and
below
1.00uH and above
Unit:mm
L(mm) G(mm) H(mm)
12.5 5.4 3.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
4R7
1713H
TAI-TECH
5. Specification
Heat Rating
Current DC
I rms.(A)
Saturation
Current DC
I sat. (A)
Part Number
Inductance
L0 A(uH)
±20%
Typ Max Typ Max
DCR
(mΩ)Typ
DCR
(mΩ)Max
Type
TMHC1004S-R15MN-D 0.15 45.0 40.0 80.0 70.0 0.50 0.60 non-leadframe
TMHC1004S-R20MN-D 0.20 40.0 37.0 75.0 65.0 0.80 1.00 non-leadframe
TMHC1004S-R22MN-D 0.22 40.0 37.0 75.0 65.0 0.80 1.00 non-leadframe
TMHC1004S-R30MN-D 0.30 38.0 35.0 70.0 60.0 1.00 1.20 non-leadframe
TMHC1004S-R33MN-D 0.33 38.0 35.0 70.0 60.0 1.00 1.20 non-leadframe
TMHC1004S-R36MN-D 0.36 36.0 33.0 60.0 52.0 1.05 1.20 non-leadframe
TMHC1004S-R47MN-D 0.47 31.0 28.0 48.0 43.0 1.30 1.50 non-leadframe
TMHC1004S-R68MN-D 0.68 24.0 22.0 45.0 40.0 2.30 2.70 non-leadframe
TMHC1004S-1R0MN-D 1.00 20.0 18.0 39.0 36.0 3.50 4.00 non-leadframe
TMHC1004S-1R5MN-D 1.50 18.0 16.0 35.0 33.0 4.70 5.30 non-leadframe
TMHC1004S-2R2MN-D 2.20 15.0 13.0 27.0 24.0 6.50 7.20
leadframe
TMHC1004S-3R3MN-D 3.30 14.0 11.0 22.0 19.0 10.8 11.8
leadframe
TMHC1004S-4R7MN-D 4.70 13.0 10.5 20.0 18.0 14.5 15.5
leadframe
TMHC1004S-5R6MN-D 5.60 12.0 10.0 16.0 14.0 18.0 19.3
leadframe
TMHC1004S-6R8MN-D 6.80 10.0 9.00 15.0 13.5 19.0 23.3
leadframe
TMHC1004S-8R2MN-D 8.20 9.00 8.00 13.5 12.5 20.0 22.5
leadframe
TMHC1004S-100MN-D 10.0 8.50 7.50 12.5 11.0 29.0 32.0
leadframe
TMHC1004S-150MN-D 15.0 6.30 6.00 10.0 8.00 40.0 45.0
leadframe
TMHC1004S-220MN-D 22.0 5.20 4.60 7.50 6.50 62.0 7.40
leadframe
TMHC1004S-330MN-D 33.0 4.00 3.50 6.00 5.00 94.0 112
leadframe
TMHC1004S-470MN-D 47.0 3.20 2.70 5.00 4.50 145 167
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125 under worst case operating conditions℃ .Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.