CONTACTING MODULES
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
82
APPLICATIONS
• Semiconductor / Sensor Test
• Medical Application Test
• Space Application Test
• Failure Analysis
• Programming
• Burn-In / HAST / THB
FEATURES
• Excellent reliability
• Low contact resistance
• Outstanding mating cycles
• Ultra low pitch capability
• Broad variety of dimensions & plunger types
GENERAL SPECIFICATIONS
Mating Cycles: >500,000
Contact resistance: <50mΩ
Contact force: ~25gf (typical)
Length: Starting from 1.00mm
Diameter: > 0.125mm
Operating temp. range: -40°C to +150°C
Task of the spring probe pin is to establish reliable contact to different IC packages such as QFP, BGA, QFN,
LGA, and other semiconductor components with a pitch from >0,25 mm (ultra-low pitch) to 2.54 mm.
Besides semiconductor, wafer-level contacting and sensor testing, our spring probe pins can be used in areas
such as medical/space, application testing, failure analysis, programming, burn-in (HAST/THB), PCB testing,
and board-to-board connectors.
YAMAICHI SPRING PROBE PINS
- AN EXELLENT CHOICE -
Contact reliability is the aim.
The concept of the spring contact combines guaranteed excellent mechanical and electrical characteristics:
• Durable stable contact design with simultaneous lowest mechanical contact
wear, i.e. no degradation of the contact force as well as minimised contact
movement on the IC component or PCB contact pad.
•Low contact resistance (< 50mΩ), even with differing surfaces.
Example: W-030/570-CTCO-P56
Resistance mΩ
Force N
Typical Performance