Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Ball Pitch
Substrate Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E1
A2
e
E
N
0.80 BSC
0.748 REF
0.40
2.348
0.30
-
2.598
-
25.00 BSC
MILLIMETERS
MIN
NOM
888
0.60
2.848
0.50
MAX
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Overall Ball Pitch
D
D1
25.00 BSC
REF: Reference Dimension, usually without tolerance, for information purposes only, shown in parentheses.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
23.20 BSC
23.20 BSC
Microchip Technology Drawing C04-25057 Rev A Sheet 2 of 2
888-Ball Thick Fine Pitch Ball Grid Array (5CC) - 25x25x2.848 mm Body [HBFBGA]
With Heat Spreader