© 2019 Microchip Technology Incorporated
B
A
0.10
C
0.10 C
0.25 C A B
0.10 C
C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.35 C
0.20 C
Microchip Technology Drawing C04-25057 Rev A Sheet 1 of 2
2X
888X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
888-Ball Thick Fine Pitch Ball Grid Array (5CC) - 25x25x2.848 mm Body [HBFBGA]
With Heat Spreader
D
E
D1
E1
e
e
2
888X Øb
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
1 3 5 7 9 11131517192123252729
2 4 6 8 10121416182022242628 30
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
A
A1
(A2)
(1.35)
(0.10)
(0.50)
SEATING
PLANE
(DATUM B)
(DATUM A)
PIN 1
INDICATOR HOLE
THROUGH HEAT
SPREADER
(3.00)
(3.00)
© 2019 Microchip Technology Incorporated
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Ball Pitch
Substrate Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E1
A2
e
E
N
0.80 BSC
0.748 REF
0.40
2.348
0.30
-
2.598
-
25.00 BSC
MILLIMETERS
MIN
NOM
888
0.60
2.848
0.50
MAX
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Overall Ball Pitch
D
D1
25.00 BSC
REF: Reference Dimension, usually without tolerance, for information purposes only, shown in parentheses.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
23.20 BSC
23.20 BSC
Microchip Technology Drawing C04-25057 Rev A Sheet 2 of 2
888-Ball Thick Fine Pitch Ball Grid Array (5CC) - 25x25x2.848 mm Body [HBFBGA]
With Heat Spreader