Chip Inductors for RF Applications / Medical Applications (Wire wound-open)

FASTRON wire wound chip inductors are designed particularly for RF applications that require optimal Q on high frequency circuits. Its gold flash pad metallization

provides better solderability for a higher yield in your production. In addition, their encapsulation not only protects the winding but also allows surface mount assembly.

It comes in compact sizes (from 0402 to 1812) available in reel packing. Inductance values between those listed in this catalog are mostly available on request. Ferrite

core versions are also available for selected case sizes for applications which require higher inductances in a smaller case size.

Applications

Used in LC resonant circuits such as oscillator and signal generators, impedance matching, RF filters etc.

Mobile Telecommunication: GSM, CDMA, TCDMA, cordless phones, 2 way radio

Automotive Subsystems: TPMS, Keyless Entry, Anti-Theft, GPS

Wireless Communication: W-LAN, WIFI, WIMAX, RFID, Bluetooth

Non-magnetic versions for medical imaging applications: ASM series

Case Sizes - 0402, 0603, 0805, 1008, 1206, 1210, 1812

Core Type - AS, AQ, ASM (Ceramic), F (Ferrite), AF (Ceramic & Ferrite)

Tolerances - F (1%), G (2%), A (3%), J (5%), K (10%), M (20%)

Packing Code - 01, 04, 08 (Taped / Reel)

Ordering Code

0402AS-1N0X-YY

Example:

0402 AS - 1N0 X - YY

(Case Size) (Core Type) (Inductance Value) (Tolerance) (Packing Code)

0402AS-1N0K-01

Revision date : 18 Dec 2018

Technical Data

L – Value (rated inductance)

≥ 1 MHz measured with HP 4286A RF LCR meter at frequency f

< 1 MHz measured with Bode 100 Vector Network Analyzer at frequency f

Q – Factor (min)

≥ 1 MHz measured with HP 4287A RF LCR meter at frequency f

< 1 MHz measured with Bode 100 Vector Network Analyzer at frequency f

SRF (min)

Measured with HP 8753ES Network Analyzer

DCR (max)

Measured at 25°C

Operating Temperature

For ceramic core from -40°C to +150°C (Including component self-heating)

For ferrite core from -40°C to +85°C

Surface Finishing

Epoxy molded flat top for perfect pick and place assembly

Pad Metallization

Gold flash as top layer for AS, AQ, F & AF

Silver flash as top layer for ASM

Wire Termination

Spot welding

Recommended soldering method

Reflow

Moisture Sensitivity Levels (MSL)

MSL Level 1, indicating unlimited floor life at ≤ 30°C / 85% relative humidity

Solderability

Using lead free solder (Sn 99.9) at 260°C ± 5°C for 5 ± 0.5 seconds, min 90% solder coverage

of metallization

Standard: IEC 68-2-20 (Ta)

Resistance to Soldering Heat

Resistant to 260°C ± 5°C for 10 ± 1 seconds

Standard: IEC 68-2-20 (Tb)

Resistance to Solvent

Resistant to Isopropyl alcohol for 5 ± 0.5 minutes at 23°C ± 5°C

Standard: IEC 68-2-45

Climatic Test

Defined by the following standards

IEC 68-2-1 for Cold test: -55°C for 96 hours

IEC 68-2-2 for Dry heat test: +85°C for ferrite core and 125°C for ceramic core for 96 hours

IEC 60068-2-78 for Humidity test: 40°C at RH 95% for 4 days

Thermal Shock Test

Temperature cycle (ceramic) : -40°C to +125°C to -40°C

Temperature cycle (ferrite) : -40°C to +85°C to -40°C

Max/Min temperature duration: 15 minutes

Temperature transition duration: 5 minutes

Cycles: 25

Standard: MIL-STD-202G

Adhesion of Soldered Component

(Shear Test)

Components withstand a pushing force of 10N for 10 ± 1 seconds

Standard: IEC 60068-2-21, method Ue

Mechanical Shock

Mil-Std 202 Method 213, Condition C

3 axis, 6 times, total 18 shocks

100 G, 6 ms, half-sine

Vibration

Mil-Std 202 Method 204

20 mins at 5G

10 Hz to 2000 Hz

12 cycles each of 3 orientations

www.fastrongroup.com

Chip Inductors for RF Applications / Medical Applications (Wire wound-open)

Fig.2

Fig.1

drawing only schematic, see table

Packing

Specification

• All dimensions in mm

Type Packing Code D D0 d d1 B b W P P0 P1 K0 T Fig

0402 01, 08 180 1.55 60 13 11.9 9.5 8 2 4 2 0.6 - 2

0603 01, 08 180 1.55 60 13 11.4 9.0 8 4 4 2 0.97 1.05 2

0603 04 330 1.55 100 13 14.4 8.4 8 4 4 2 0.97 1.05 2

0805 01, 08 180 1.55 60 13 11.4 9.0 8 4 4 2 1.63 0.25 1

0805 04 330 1.55 100 13 14.4 8.4 8 4 4 2 1.63 0.25 1

1008 01,08 180 1.50 60 13 11.4 9.5 8 4 4 2 2.23 0.30 1

1008 04 330 1.55 100 13 14.4 8.4 8 4 4 2 1.63 0.25 1

1206 01,08 180 1.50 60 13 18.4 13.7 12 4 4 2 1.8 0.30 1

1206 04 330 1.50 100 13 18.4 12.4 12 4 4 2 1.8 0.30 1

1210 01 180 1.55 60 13 18.4 13.7 12 8 4 2 2.55 0.30 1

1210 04 330 1.55 100 13 18.4 12.4 12 8 4 2 2.55 0.30 1

1812 01 180 1.50 60 13 18.4 13.7 12 8 4 2 3.70 0.35 1

1812 04 330 1.50 100 13 18.4 12.4 12 8 4 2 3.70 0.35 1

Packing Specification

Revision date : 18 Dec 2018