CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe
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Material Composition Declaration
© Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under
both international and Pan-American copyright conventions.
This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly
with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has
engineering responsibility.
Adobe Reader version 7.0.5 is required to complete this declaration.
IPC-1752-2 v1.01
IPC Web Site for Information on IPC-1752 Standard
http://www.ipc.org/IPC-175x
Form Type *
Supplier Information
Company Name *
Company Unique ID
Unique ID Authority
Response Date *
Response Document ID
Contact Name *
Title - Contact
Phone - Contact *
Email - Contact *
Authorized Representative *
Title - Representative
Phone - Representative *
Email - Representative *
Supplier Comments or URL for Additional Information
Requester Item Number
Mfr Item Number
Mfr Item Name
Effective Date
Manufacturing Site
Weight
UOM
Unit Type
Version
Alternate Recommendation
Alternate Item Comments
Manufacturing Process Information
C
Terminal Plating / Grid Array Material
Terminal Base Alloy
J-STD-020 MSL Rating
Peak Process Body Temperature
Max Time at Peak Temperature
seconds
Number of Reflow Cycles
Comments
1752-2
Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Information
Distribute
IDT
2006-10-04
PS32
CS Phek
Engineer
604-613-2538
csphek@idt.com
CS Phek
Engineer
604-613-2538
csphek@idt.com
Duplicate Contact -> Authorized Representative
PS32
2006-10-04
0
ATP
841
mg
Each
Tin/Lead (Sn85Pb15)
CU Alloy
3
225
20
3
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RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium
RoHS Material Composition Declaration
Declaration Type *
RoHS Declaration *
Supplier Acceptance
Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration
above and checkboxes will appear below. Check all applicable exemptions.
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices).
2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg in halophosphate
lamps
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications
banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the
marketing and use of certain dangerous substances and preparations piezoelectronic devices).
2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg in triphosphate
lamps with a normal lifetime
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption
refrigerators
2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg in triphosphate
lamps with long lifetime
10a. Deca BDEin polymeric applications
3. Mercury in straight fluorescent lamps for special purposes.
10b. Lead in lead-bronze bearing shells
4. Mercury in other lamps not specifically mentioned in this list.
11. Lead used in compliant pin connector systems.
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
12. Lead as a coating material for a thermal conduction module c-ring.
6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.
13a. Lead in optical and filter glass.
6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.
13b. Cadmium in optical and filter glass.
6c. Lead as an alloying element in copper containing up to 4% lead by weight.
14. Lead in solders consisting of more than two elements for the connection between the pins and the
package of microprocessors with a lead content of more than 80% and less than 85% by weight .
7a. Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by
weight or more lead).
15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier
within integrated circuit Flip Chip packages.
7b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment
for switching, signalling, transmission as well as network management for telecommunications.
Declaration Signature
Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign
the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester.
Supplier Digital Signature
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RoHS Directive
2002/95/EC
Simplified
Supplier certifies that it gathered the information it provides in this form concerning RoHS restrictive substances using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the
date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that
Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others,
Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a
written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s
remedies for issues that arise regarding information the Supplier provides in this form.
2 - Item(s) contains RoHS restricted substances above the limits per the definition and is not under exemption
Accepted
CS Phek
Digitally signed by CS Phek
DN: cn=CS Phek, c=US, o=Assembly Engineering, ou=Integrated Device Technology Inc.,
email=csphek@idt.com
Reason: I am the author of this document
Date: 2007.06.25 14:06:51 +08'00'