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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
MATERIAL DECLARATION SHEET
This Document was updated on:
4-25-2018
Material Number
SF-0402S
Product Line
Lead Free Thin Film Chip Fuse
Compliance Date
2017/07/05
RoHS Compliant
Yes
MSL 1
No.
Construction
Element (subpart)
Homogeneous
Material
Material
weight [g]
Homogeneous
Material\
CASRN
Materials
Mass %
Mass %
of total
mass of
total wt.
Substances if applicable
1 Ceramic Substrate Ceramic 0.000311956
79.54%
2 Inner Conductor
Tungsten
0.00000263
0.67%
3 Isolation Quartz
14808-60-7 100% 0.89% 0.89%
4 Fuse Element
Copper
0.0000026
7440-50-8 90% 0.60%
0.67%
6 End Terminal
Nickel
Chromium
0.0000003
0.07%
8 Cu Plating
7440-50-8 100% 5.26%
5.63%
9 Ni Plating
7440-02-0 100% 3.47%
10 Sn plating
7440-31-5 100% 3.10%