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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
MATERIAL DECLARATION SHEET
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [mg]
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Subpart
mass of total
wt. (%)
Carbon
7440-44-0
40.98%
16.06%
Oxygen
7782-44-7
35.92%
14.08%
Silicon
7440-21-3
18.11%
7.10%
Hydrogen
1333-74-0
3.73%
1.46%
Aluminum
7429-90-5
0.26%
0.10%
Calcium
7440-70-2
0.36%
0.14%
1
Body Copper Layer
(Fuselink）
Copper Clad
Laminate (FR4)
0.16522
Copper
7440-50-8
0.65%
0.25%
39.197%
2
Tin Layer
(Fuselink)
Tin
0.00020
Tin
7440-31-5
100%
0.05%
0.047%
3
Copper Layer
(Termination)
Copper
0.10546
Copper
7440-50-8
100%
25.02%
25.02%
Nickel
Nickel
7440-02-0
100.00%
8.32%
4
Plating
Tin
0.06377
Tin
7440-31-5
100.00%
6.81%
15.129%
Carbon
7440-44-0
31.37%
5.95%
Oxygen
7782-44-7
36.70%
6.96%
Titanium
7440-32-6
8.83%
1.68%
Barium
7440-39-3
3.31%
0.63%
Hydrogen
1333-74-0
6.84%
1.30%
Silicon
7440-21-3
3.82%
0.73%
Magnesium
7439-95-4
7.23%
1.37%
Sulfur
7704-34-9
0.77%
0.15%
5
Cover
Soldermask Ink
0.07996
Nitrogen
7727-37-9
1.12%
0.21%
18.970%
Material Number
SF-0402FPxxxF
Product Line
Lead Free Thin Film Chip Fuse
Compliance Date
08/30/2017
RoHS Compliant
YES
MSL
1
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
MATERIAL DECLARATION SHEET
Carbon
7440-44-0
33.81%
0.56%
Oxygen
7782-44-7
39.56%
0.66%
Titanium
7440-32-6
9.52%
0.16%
Barium
7440-39-3
3.57%
0.06%
Hydrogen
1333-74-0
7.38%
0.12%
Silicon
7440-21-3
4.12%
0.07%
Sulfur
7704-34-9
0.83%
0.01%
6
Marking Code
Marking ink
0.00690
Nitrogen
7727-37-9
1.20%
0.02%
1.637%
Total weight
0.42151
This Document was updated on: 8-30-17
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