Headquarters Riverside CA www.bourns.com
page 1 of 1
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
MATERIAL DECLARATION SHEET
This Document was updated on:
4-25-2018
Material Number
SF-0402F
Product Line
Lead Free Thin Film Chip Fuse
Compliance Date
2017/07/05
RoHS Compliant
Yes
MSL 1
No.
Construction
Element (subpart)
Homogeneous
Material
Material
weight [g]
Homogeneous
Material\
CASRN
Materials
Mass %
Material
Mass %
of total
unit wt.
Subpart
mass of
total wt.
(%)
Substances if applicable
1 Ceramic Substrate Ceramic 0.000311956
Aluminum oxide
1344-28-1
96%
76.36%
79.54%
Quartz
14808-60-7
3%
2.39%
Magnesium oxide
1309-48-4
1%
0.80%
2 Inner Conductor
Titanium
Tungsten
0.00000263
Titanium
7440-32-6
13.5%
0.09%
0.67%
Tungsten
7440-33-7
1.5%
0.01%
Copper
Copper
7440-50-8
85%
0.57%
3 Isolation Quartz
0.0000035
Quartz
14808-60-7 100% 0.89% 0.89%
4 Fuse Element
Copper
0.0000026
Copper
7440-50-8 90% 0.60%
0.67%
Tin
Tin
7440-31-5
10%
0.07%
5
Over-Coating
Epoxy
0.0000165
Epoxy
29690-82-2
100%
4.20%
4.20%
6 End Terminal
Nickel
Chromium
0.0000003
Nickel
7440-02-0
80%
0.06%
0.07%
Chromium
7440-47-3
20%
0.01%
7
Marking
Epoxy
0.0000006
Epoxy
25085-99-8
100%
0.15%
0.15%
8 Cu Plating
Copper
0.0000221
Copper
7440-50-8 100% 5.26%
5.63%
5.63%
9 Ni Plating
Nickel
0.0000169
Nickel
7440-02-0 100% 3.47%
4.31%
10 Sn plating
Tin
0.0000152
Tin
7440-31-5 100% 3.10%
3.87%
TOTAL WEIGHT
0.0003922
4.31%