© 2018 Microchip Technology Incorporated
0.15
C D
2X
NOTE 1
12
N
TOP VIEW
SIDE VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
0.20
C
C
SEATING PLANE
A
A2
A1
e
NX bB
0.20 C A-B D
e1
D
E1
E1/2
E/2
E
D
A
0.20 C 2X
(DATUM D)
(DATUM A-B)
A
A
SEE SHEET 2
0.20 C
© 2018 Microchip Technology Inc.
Microchip Technology Drawing C04-21344 Rev B Sheet 1 of 2
5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]
Atmel Legacy Global Package Code TSZ
© 2018 Microchip Technology Incorporated
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
(c)
L
L1
θ
VIEW A-A
SHEET 1
protrusions shall not exceed 0.25mm per side.
1.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2.
Foot Angle
Number of Leads
Pitch
Outside lead pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Lead Width
Notes:
L1
θ
b
c
Dimension Limits
E
E1
D
L
e1
A
A2
A1
Units
N
e
0°
0.08
0.30 -
-
-
8°
0.20
0.50
MILLIMETERS
0.95 BSC
1.90 BSC
0.30
-
0.70
-
0.60 REF
2.90 BSC
-
2.80 BSC
1.60 BSC
0.90
-
-
MIN
5
NOM
1.10
1.00
0.10
0.60
MAX
REF: Reference Dimension, usually without tolerance, for information purposes only.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Dimensioning and tolerancing per ASME Y14.5M
© 2018 Microchip Technology Inc.
Microchip Technology Drawing C04-21344 Rev B Sheet 2 of 2
5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]
Atmel Legacy Global Package Code TSZ