© Semiconductor Components Industries, LLC, 2014
September, 2018 − Rev. 15
1 Publication Order Number:
ESD5Z2.5T1/D
ESD5Z2.5T1G Series,
SZESD5Z2.5T1G Series
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESD5Z Series is designed to protect voltage sensitive
components from ESD and transient voltage events. Excellent
clamping capability, low leakage, and fast response time, make these
parts ideal for ESD protection on designs where board space is at a
premium. Because of its small size, it is suited for use in cellular
phones, portable devices, digital cameras, power supplies and many
other portable applications.
Specification Features:
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
• Low Body Height: 0.028″ (0.7 mm)
• Stand−off Voltage: 2.5 V − 1 2 V
• Peak Power up to 240 Watts @ 8 x 20 ms Pulse
• Low Leakage
• Response Time is Typically < 1 ns
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• IEC61000−4−4 Level 4 EFT Protection
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
†
ORDERING INFORMATION
SOD−523
CASE 502
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
www.onsemi.com
XX = Specific Device Code
M = Date Code
G = Pb−Free Package
XX
1
2
M
G
G
(Note: Microdot may be in either location)
SZ/ESD5ZxxxT1G SOD−523
Pb−Free
3000 /
Tape & Reel
*Date Code orientation may vary
depending upon manufacturing location.
SZ/ESD5ZxxxT5G SOD−523
Pb−Free
8000 /
Tape & Reel
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 61000−4−2 (ESD)
Contact
Air
±30
±30
kV
IEC 61000−4−4 (EFT) 40 A
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
Total Power Dissipation on FR−4 Board (Note 1) @ T
A
= 25°C °P
D
° 500 mW
Junction and Storage Temperature Range T
J
, T
stg
−55 to +150 °C
Lead Solder Temperature − Maximum (10 Second Duration) T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm
2
.
See Application Note AND8308/D for further description of survivability specs.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Symbol
Parameter
I
PP
Maximum Reverse Peak Pulse Current
V
C
Clamping Voltage @ I
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
BR
Breakdown Voltage @ I
T
I
T
Test Current
I
F
Forward Current
V
F
Forward Voltage @ I
F
P
pk
Peak Power Dissipation
C Max. Capacitance @V
R
= 0 and f = 1 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
I
PP
I
F
V
I
I
R
I
T
V
RWM
V
C
V
BR
V
F
Uni−Directional