Product Reliability
Reliability Results for Product Type PHDMI2FR4
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Time period: Q1/2018 to Q4/2018
Test Results
Test
Conditions
Duration
Quantity
Rejects
# 1
TEST
Pre- and Post-Stress
Electrical Test
T
amb
= 25 °C
N/A
all parts
see below
# 2
PC
Preconditioning
JESD22-A113
Bake T
amb
= 125 °C
Soak T
amb
= 85 °C, RH = 85%
Reflow soldering
24 hours
168 hours
3 cycles
8435
0
# 5
HTRB
High Temperature
Reverse Bias
MIL-STD-750-1
M1038 Method A
T
j
= T
jmax
, Vr = 100% of max.
datasheet reverse voltage
1000 hours
560
0
# 7
TC
Temperature Cycling
JESD22-A104
-55 °C to T
jmax
, not to exceed 150°C
1000 cycles
3150
0
# 8
AC
Autoclave
JESD22-A102
T
amb
= 121 °C, RH = 100 %
Pressure = 205 kPa (29.7 psia)
96 hours
2000
0
# 9
H3TRB
High Humidity High
Temperature Reverse Bias
JESD22-A101
T
amb
= 85 °C, RH = 85%, V
R
> 80 % of
rated reverse voltage
1000 hours
3285
0
# 10
IOL
Intermittent Operating
Life
MIL-STD-750 Method 1037
t
on
= t
off
, devices powered to insure
ΔT
j
= 100 °C for 15000 cycles
1000 hours
n.a.
n.a.
# 20
RSH
Resistance to Solder Heat
JESD22-A111
260 °C ± 5 °C
10 s
360
0
# 21
SD
Solderability
J-STD-002
Test method B and D
180
0
Calculation of FIT and MTBF
Test considered for FIT calculation: High Temperature Reverse Bias (HTRB, Test # 5)
Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168 to 1000 hours
Wafer Fab
Technology
Quantity
Rejects
Failure Rate
MTBF
NXP ICN8
Protection INDI
560
0
7.59 FIT
15043 years