TAI-TECH
www.tai-tech.com.tw
P1
leadframe
non‐leadframe
1. Features
2. Applications
3. Dimensions
100
1536
C
D
A
B
E
R22
1536
C
D
A
B
E
4. Part Numbering
SMD Power Inductor
TMPA1265SPV-Series(N)-D
Halogen-free
Halogen
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. High reliability -Reliability test complied to AEC-Q200.
8. Operating temperature: -55~+155℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMPA 1265 SPV - 100 MN
- D
A B C D E
F
A: Series
B: Dimension BxC.
C: Type Standard. P:PAD broaden. V=Vehicle.
D: Inductance 100=10.0uH
E: Inductance Tolerance M=±20%
F: Code Marking: Black.100 and 1536(15 YY, 36 WW,follow production date).
Recommend PC Board Pattern
L
G
H
L(mm) G(mm) H(mm)
14.5 8.0 5.0
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Series A B C D E Inductance
TMPA1265 13.5±0.5 12.6±0.2 6.2±0.3 2.3±0.3
4.0±0.3 0.68~1.50uH among
4.7±0.3
0.22uH and below
2.20uH and above
Unit: mm
TAI-TECH
www.tai-tech.com.tw
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
( A ) Irms.
Saturation
Current DC
(A)I sat
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
Type
Typ Max Typ Max
TMPA1265SPV-R10YN-D
0.10±30%
65 60 120 115 0.2 0.25
non-leadframe
TMPA1265SPV-R22MN-D 0.22 53 42 112 105 0.4 0.46
non-leadframe
TMPA1265SPV-R68MN-D 0.68 36.5 33 55 46 1.25 1.5
non-leadframe
TMPA1265SPV-1R0MN-D 1.00 33 29 45 36 1.5 1.8
non-leadframe
TMPA1265SPV-1R5MN-D 1.50 29 25 35 30 2.2 2.53
non-leadframe
TMPA1265SPV-2R2MN-D 2.20 25 21 28.5 24 3.7 4.2
leadframe
TMPA1265SPV-3R3MN-D 3.30 22 19 27 22.5 5.3 6.2
leadframe
TMPA1265SPV-4R7MN-D 4.70 20 17 25 21 6.8 8.0
leadframe
TMPA1265SPV-5R6MN-D 5.60 18 15 23 19.5 8.3 9.8
leadframe
TMPA1265SPV-6R8MN-D 6.80 16.5 14 21 18 9.8 11.3
leadframe
TMPA1265SPV-8R2MN-D 8.20 15 12.5 19 17 12 13.8
leadframe
TMPA1265SPV-100MN-D 10.0 13 11 17 15 13 15.8
leadframe
TMPA1265SPV-220MN-D 22.0 10 8 10 9 31 35
leadframe
TMPA1265SPV-330MN-D 33.0 9 6.5 9 8 46 55
leadframe
TMPA1265SPV-470MN-D 47.0 8.0 5.7 7.6 6.8 58 67
leadframe
TMPA1265SPV-680MN-D 68.0 5.8 4.8 6.0 5.0 82 100
leadframe
TMPA1265SPV-820MN-D 82.0 5.0 4.0 5.0 4.2 110 132
leadframe
TMPA1265SPV-101MN-D 100 5.0 3.8 5.0 4.0 140 161
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33 420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155 under worst case operating conditions℃ .Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.