TAI-TECH
www.tai-tech.com.tw
P1
1. Features
2. Applications
3. Dimensions
A
B
C
E
D
T
A`
R33
1602
4. Part Numbering
SMD Power Inductor
TMPA0604SV-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. High reliability -Reliability test complied to AEC-Q200
8. Operating temperature: -55~+155℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
Recommend PC Board Pattern
L
G
H
L
(
mm
)
G
(
mm
)
H
(
mm
)
8.0 3.7 3.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Series A A` B C D E T
TMPA0604 7.1±0.3 6.4±0.3 6.6±0.2 3.8±0.2 1.6±0.3 3.0±0.2 0~0.15
Unit: mm
TMPA 0604 SV - R33 MN
- D
A B C D E
F
A: Series
B: Dimension BxC
C: Type Standard.. V:Vehicle
D: Inductance R33=0.33uH
E: Inductance Tolerance M=±20%
F:
Code Marking: Black.R33 and 1602(16 YY, 02 WW,follow production date).
Halogen-free
Halogen
TAI-TECH
www.tai-tech.com.tw
P2
5. Specification
6. Typical Performance Curves
0 8 16 24 32 40
DC CU
R
R
ENT
(
A
)
0
0.1
0.2
0.3
0.4
0.5
INDUCT
A
NCE (u H)
0
14
28
42
56
70
TEMP.
R
ISE
(
o
C
)
TMPA0604-R33
0 5.6 11.2 16.8 22.4 28
DC CU
R
R
ENT
(
A
)
0
0.16
0.32
0.48
0.64
0.8
INDUCT
A
NCE (u H)
0
14
28
42
56
70
TEMP.
R
ISE
(
o
C
)
TMPA0604-R45
0 5 10 15 20 25
DC CURRENT
(
A
)
0
0.18
0.36
0.54
0.72
0.9
INDUCT
A
NCE (uH)
0
12
24
36
48
60
TEMP. RISE
(
o
C
)
TMPA0604-R56
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
( A ) Irms.
Saturation
Current DC
(A)I sat
DCR
(mΩ)Typ
DCR
(mΩ)Max
Typ Max Typ Max
TMPA0604SV-R33MN-D 0.33 25 23 28 25 2.2 2.5
TMPA0604SV-R45MN-D 0.45 20 18 21 18 2.8 3.2
TMPA0604SV-R56MN-D 0.56 19 16 20 17 3.4 3.7
TMPA0604SV-1R0MN-D 1.00 15 13 15 13.5 5.6 6.2
Note:
1. Test frequency : Ls : 100KHz /1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR MET ER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise app roxima tely ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155 under w℃ orst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TMPA0604SV-R33
TMPA0604SV-R45
TMP
A
0604SV-R56
TMPA0604SV-1R0