TAI-TECH
www.tai-tech.com.tw
P1
1. Features
2. Applications
3. Dimensions
A
B
C
E
D
1R0
1802
T
4. Part Numbering
SMD Power Inductor
TMPA0603SV-Series(N)-D
Halogen-free
Halogen
1. Shielded construction.
2. Capable of corresponding high frequency
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to c omposite constructio n.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. High reliability -Reliability test complied to AEC-Q200
8. Operating temperature: -55~+155℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMPA 0603 SV - 1R0 MN
- D
A B C D E F
A: Series
B: Dimension BxC
C: Type Standard. V:Vehicle
D: Inductance 1R0=1.0uH
E: Inductance Tolerance M=±20%
F:
Code Marking: Black.1R0 and 1802(18 YY,02 WW,follow production date).
Recommend PC Board Pattern
L
G
H
L(mm) G(mm) H(mm)
8.0 3.7 3.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Series A B C D E T
TMPA0603 7.1±0.3 6.6±0.2 2.8±0.2 1.6±0.3 3.0±0.2 0~0.15
Unit: mm
TAI-TECH
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
( A ) Irms.
Saturation
Current DC
(A)I sat
DCR
(mΩ)Typ
DCR
(mΩ)Max
Typ Max Typ Max
TMPA0603SV-R15YN-D 0.15±30% 30 25 40 36 1.7 2.1
TMPA0603SV-R22MN-D 0.22 23 21 34 32 2.0 2.5
TMPA0603SV-R33MN-D 0.33 21 20 25 22 2.8 3.4
TMPA0603SV-R36MN-D 0.36 20 18 24 21 3.3 3.9
TMPA0603SV-R47MN-D 0.47 18 16 20 18 3.4 4.0
TMPA0603SV-R56MN-D 0.56 16.5 15 18 16 3.9 4.5
TMPA0603SV-R68MN-D 0.68 16 14.5 17 15 4.7 5.3
TMPA0603SV-R82MN-D 0.82 14 13 16 14 5.4 6.0
TMPA0603SV-1R0MN-D 1.00 12 11 15 13.5 6.7 7.4
TMPA0603SV-1R2MN-D 1.20 10 9.5 14 12.5 7.7 9.5
TMPA0603SV-1R5MN-D 1.50 10 9.0 14 12 10.2 12.1
TMPA0603SV-1R8MN-D 1.80 9.0 8.0 12 10 10.9 13
TMPA0603SV-2R2MN-D 2.20 8.0 7.5 10 9.0 13.5 15
TMPA0603SV-2R7MN-D 2.70 7.2 7.0 9.8 8.8 17.3 20
TMPA0603SV-3R3MN-D 3.30 6.5 6.0 9.5 8.5 19 22
TMPA0603SV-4R7MN-D 4.70 5.5 5.0 6.5 5.5 28 33
TMPA0603SV-5R6MN-D 5.60 5.5 5.0 6.0 5.2 39 42
TMPA0603SV-6R8MN-D 6.80 4.5 4.2 6.0 5.0 43 50
TMPA0603SV-8R2MN-D 8.20 4.5 4.0 6.0 4.7 54 60
TMPA0603SV-100MN-D 10.0 4.0 3.5 5.5 4.5 62 68
TMPA0603SV-150MN-D 15.0 3.0 2.5 4.5 4.0 110 140
TMPA0603SV-220MN-D 22.0 2.5 2.0 3.0 2.5 150 190
TMPA0603SV-330MN-D 33.0 2.1 1.8 2.5 2.0 215 258
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155 under worst case operating conditions℃ .Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.