TAI-TECH
P1
1. Features
2. Applications
3. Dimensions
A
B
C
E
D
820
1551
A`
4. Part Numbering
TMPA1707SP-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
1. DC/DC converters in distributed pow er systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMPA 1707 SP - 820 MN
- D
A B C D E
F
A: Series
B: Dimension BxC.
C: Type Standard.
D: Inductance 820=82.0uh.
E: Inductance Tolerance M=±20%.
F: Code Marking: Black.820 and 1551(15 YY, 51 WW,follow production date).
Pb-free
Pb
SMD Power Inductor
Recommend PC Board Pattern
L
G
H
L(mm) G(mm) H(mm)
18.5 12.0 12.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.17mm and above.
Series A A` B C D E
TMPA1707 17.8±0.5 16.9±0.3 16.9±0.3
6.7±0.3 2.3±0.3
11.9±0.3
Unit:mm
Halogen-free
Halogen
TAI-TECH
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
( A ) Irms.
Saturation
Current DC
(A)I sat
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
Typ Max Typ Max
TMPA1707SP-R47MN-D 0.47 60 55 110 100 0.7 0.9
TMPA1707SP-R56MN-D 0.56 56 50 80 70 0.81 0.97
TMPA1707SP-1R0MN-D 1.00 46 42 50 45 1.06 1.3
TMPA1707SP-1R5MN-D 1.50 39 35 46 40 1.5 1.8
TMPA1707SP-1R8MN-D 1.80 35 32 40 34 1.7 2.0
TMPA1707SP-2R2MN-D 2.20 32 30 35 32 1.8 2.2
TMPA1707SP-3R3MN-D 3.30 30 28 32 29 2.7 3.3
TMPA1707SP-4R7MN-D 4.70 28 26 29 26 3.7 4.5
TMPA1707SP-6R8MN-D 6.80 24 22 25 22 6.0 7.2
TMPA1707SP-100MN-D 10.0 21 19 22 19 9.2 10.6
TMPA1707SP-150MN-D 15.0 16 14 16 14 12.8 15.5
TMPA1707SP-220MN-D 22.0 13.5 11.5 13.5 11.5 20.5 24
TMPA1707SP-330MN-D 33.0 12 10 12 10 32 37
TMPA1707SP-470MN-D 47.0 9.5 8.0 9.5 8.0 40 47
TMPA1707SP-820MN-D 82.0 6.5 5.7 8.0 6.5 69 83
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40 ℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125 under w℃ orst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.